2024
Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects
Seongi Lee¹, Jae-Myeong Shin¹, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo, Byoung-Joon Kim*, So-Yeon Lee*
Journal of Materials Research and Technology, 2024, 29, 851-856
2024
Bonding structure and dry etching characteristics in amorphous B-C-N films for hardmask applications
Hongik Kim¹, Unggi Kim¹, Deokgi Hong, Sungtae Kim, Seungwu Han, Young-Chang Joo*, and So-Yeon Lee*
Carbon, 2024, 226, 119218
2024
Understanding the Electrical Characteristics of Electrochemical Metallization Memristors through Identification of Conduction Channel in Entire Active Area
Dokyun Kim¹, Unggi Kim, Sungjae Choi, and Young-Chang Joo*
Electronic Materials Letters, 2024, 20, 525-536
2024
Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films
Jae Young Hwang¹, Dokyun Kim¹, Hyejin Jang*, So-Yeon Lee*, and Young-Chang Joo*
Electronic Materials Letters, 2024, 20, 648-656
2024
Thermodynamic phase control of Cu-Sn alloy electrocatalysts for selective CO2 reduction
Soohyun Go, Woosuck Kwon, Deokgi Hong, Taemin Lee, Sang-Ho Oh, Daewon Bae, Jeong-Heon Kim, Seolha Lim, Young-Chang Joo, Dae-Hyun Nam*
Nanoscale Horizons, (2024)
2024
Fully Biodegradable Electrochromic Display for Disposable Patch
Se-Hun Kang, Ju-Yong Lee, Joo-Hyeon Park, Sung-Geun Choi, Sang-Ho Oh, Young-Chang Joo, Seung-Kyun Kang*
npj Flexible Electronics, 2024, 8, 72
2024
Porous Cu/C nanofibers promote electrochemical CO2-to-ethylene conversion via high CO2 availability
Daewon Bae, Taemin Lee, Woosuck Kwon, Sang-Ho Oh, Dae-Hyun Nam*
Journal of Materials Chemistry A, 2024, 12, 17295-17305
2024
Predictive synthesis of transition metal carbide via thermochemical oxocarbon equilibrium
Sang-Ho Oh, Dohun Kim, Ji-Yong Kim, Geosan Kang, Jooyoung Jeon, Miyoung Kim, Young-Chang Joo* and Dae-Hyun Nam*
Journal of the American Chemical Society, 2024, 146, 26, 17940-17955
2023
Effect of N doping on the microstructure and dry etch properties of amorphous carbon deposited with a DC sputtering system
Sungtae Kim¹, Min-Woo Jeong¹, Kuntae Kim, Ung-gi Kim, Miyoung Kim, So-Yeon Lee * and Young-Chang Joo*
RSC Advances, 2023, 13(3), 2131–2139
2023
Unravelling rate-determining step and consequence of O2- or H2O-assisted, wet CO transformation on catalytic CuO-CeO2 domains via interfacial engineering
Dong Ho Kim¹, Sang-Ho Oh¹, Heon Phil Ha, Young-Chang Joo*, Jongsik Kim*
Applied Surface Science, 2023, 614, 156099
2023
Copper Bonding Technology in Heterogeneous Integration
Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*
Electronic Materials Letters, 2023, 20, 1-25
2023
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*
IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641
2023
Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties
Sungtae Kim, Ung-gi Kim, Jinseok Ryu, Dokyun Kim, Miyoung Kim, Young-Chang Joo* and So-Yeon Lee*
Applied Surface Science, 2023, 637, 157895
2023
Selective hydrocarbon or oxygenate production in CO2 electroreduction over metallurgical alloy catalysts
Ji-Yong Kim¹, Heh Sang Ahn¹, Intae Kim¹, Deokgi Hong, Taemin Lee, Jaeyeon Jo, Hyeontae Kim, Min Kyung Kwak, Hyoung Gyun Kim, Geosan Kang, Soohyun Go, Wook Ha Ryu, Gun-Do Lee, Miyoung Kim, Dae-Hyun Nam*, Eun Soo Park* and Young-Chang Joo* | Nature Synthesis, 2023
2022
Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*
IEEE Access, 2022, 10, 100675-100681
2022
Robust Co alloy design for Co interconnects using a self‑forming barrier layer
Cheol Kim, Geosan Kang, Youngran Jung, Ji‑Yong Kim, Gi‑Baek Lee, Deokgi Hong, Yoongu Lee, Soon‑Gyu Hwang, In‑Ho Jung, Young‑Chang Joo*
Scientific Reports, 2022, 12, 12291
2022
Interfacial Adhesion Energies of Uniformly Self‑Formed Cr2O3 Barriers for Advanced Co Interconnects
Seongi Lee, Soon‑Gyu Hwang, Gahui Kim, Cheol Kim, Woobin Kwon, Young‑Bae Park, Young‑Chang Joo*
Electronic Materials Letters, 2022, 18, 447–455
2022
Correlative study between the local atomic and electronic structures of amorphous carbon materials via 4D-STEM and STEM-EELS
Jinseok Ryu, Sangmin Lee, Sungtae Kim, Young-Chang Joo, Miyoung Kim*
Applied Physics Letters, 2022, 121, 042101
2022
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee*, Byoung-Joon Kim*
Journal of Electronic Packaging, 2022, 144(4), 041017
2021
Phase Engineering of Transition Metal Dichalcogenides via a Thermodynamically Designed Gas-Solid Reaction
Geosan Kang, Deokgi Hong, Ji-Yong Kim, Gun-Do Lee, Sungwoo Lee*, Dae-Hyun Nam*, and Young-Chang Joo*
The Journal of Physical Chemistry Letters, 2021, 12(34), 8430-8439