2025

In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors

Youngran Jung, Wonhyo Joo, Kyung Rul Lee, Cheol Kim, Min-Jung Choi, Young-Chang Joo*, So-Yeon Lee*

Electronic Materials Letters 421, 464–472 (2025)

2025

Optimization of co-sputtered zinc indium tin oxide-based MOSFET-type sensor for effective NO2 gas detection

Hunhee Shin1, Jinwoo Park, Donghee Kim, Kangwook Choi, Min-Kyu Park, Joon Hwang, Seongi Lee, Young-Chang Joo, Gyuweon Jung*, Jong-Ho Lee*

Sensors & Actuators: B. Chemical 428 (2025) 137262

2025

Unveiling the reconstruction of copper bimetallic catalysts during CO2 electroreduction

Intae Kim1, Gi-Baek Lee1, Sungin Kim, Hyun Dong Jung, Ji-Yong Kim, Taemin Lee, Hyesung Choi, Jaeyeon Jo, Geosan Kang, Sang-Ho Oh, Woosuck Kwon, Deokgi Hong, Hyoung Gyun Kim, Yujin Lee, Unggi Kim, Hyeontae Kim, Miyoung Kim, Seoin Back*, Jungwon Park*, Young-Chang Joo* & Dae-Hyun Nam*

Nature Catalysis, 2025, 8, 697-713

2024

Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects

Seongi Lee¹, Jae-Myeong Shin¹, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo, Byoung-Joon Kim*, So-Yeon Lee*

Journal of Materials Research and Technology, 2024, 29, 851-856

2024

Bonding structure and dry etching characteristics in amorphous B-C-N films for hardmask applications

Hongik Kim¹, Unggi Kim¹, Deokgi Hong, Sungtae Kim, Seungwu Han, Young-Chang Joo*, and So-Yeon Lee*

Carbon, 2024, 226, 119218

2024

Understanding the Electrical Characteristics of Electrochemical Metallization Memristors through Identification of Conduction Channel in Entire Active Area

Dokyun Kim¹, Unggi Kim, Sungjae Choi, and Young-Chang Joo*

Electronic Materials Letters, 2024, 20, 525-536

2024

Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films

Jae Young Hwang¹, Dokyun Kim¹, Hyejin Jang*, So-Yeon Lee*, and Young-Chang Joo*

Electronic Materials Letters, 2024, 20, 648-656

2024

Thermodynamic phase control of Cu-Sn alloy electrocatalysts for selective CO2 reduction

Soohyun Go, Woosuck Kwon, Deokgi Hong, Taemin Lee, Sang-Ho Oh, Daewon Bae, Jeong-Heon Kim, Seolha Lim, Young-Chang Joo, Dae-Hyun Nam*

Nanoscale Horizons, (2024)

2024

Fully Biodegradable Electrochromic Display for Disposable Patch

Se-Hun Kang, Ju-Yong Lee, Joo-Hyeon Park, Sung-Geun Choi, Sang-Ho Oh, Young-Chang Joo, Seung-Kyun Kang*

npj Flexible Electronics, 2024, 8, 72

2024

Porous Cu/C nanofibers promote electrochemical CO2-to-ethylene conversion via high CO2 availability

Daewon Bae, Taemin Lee, Woosuck Kwon, Sang-Ho Oh, Dae-Hyun Nam*

Journal of Materials Chemistry A, 2024, 12, 17295-17305

2024

Predictive synthesis of transition metal carbide via thermochemical oxocarbon equilibrium

Sang-Ho Oh, Dohun Kim, Ji-Yong Kim, Geosan Kang, Jooyoung Jeon, Miyoung Kim, Young-Chang Joo* and Dae-Hyun Nam*

Journal of the American Chemical Society, 2024, 146, 26, 17940-17955

2023

Effect of N doping on the microstructure and dry etch properties of amorphous carbon deposited with a DC sputtering system

Sungtae Kim¹, Min-Woo Jeong¹, Kuntae Kim, Ung-gi Kim, Miyoung Kim, So-Yeon Lee * and Young-Chang Joo*

RSC Advances, 2023, 13(3), 2131–2139

2023

Unravelling rate-determining step and consequence of O2- or H2O-assisted, wet CO transformation on catalytic CuO-CeO2 domains via interfacial engineering

Dong Ho Kim¹, Sang-Ho Oh¹, Heon Phil Ha, Young-Chang Joo*, Jongsik Kim*

Applied Surface Science, 2023, 614, 156099

2023

Copper Bonding Technology in Heterogeneous Integration

Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*

Electronic Materials Letters, 2023, 20, 1-25

2023

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*

IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641

2023

Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties

Sungtae Kim, Ung-gi Kim, Jinseok Ryu, Dokyun Kim, Miyoung Kim, Young-Chang Joo* and So-Yeon Lee*

Applied Surface Science, 2023, 637, 157895

2023

Selective hydrocarbon or oxygenate production in CO2 electroreduction over metallurgical alloy catalysts

Ji-Yong Kim¹, Heh Sang Ahn¹, Intae Kim¹, Deokgi Hong, Taemin Lee, Jaeyeon Jo, Hyeontae Kim, Min Kyung Kwak, Hyoung Gyun Kim, Geosan Kang, Soohyun Go, Wook Ha Ryu, Gun-Do Lee, Miyoung Kim, Dae-Hyun Nam*, Eun Soo Park* and Young-Chang Joo* | Nature Synthesis, 2023

2022

Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape

Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*

IEEE Access, 2022, 10, 100675-100681

2022

Robust Co alloy design for Co interconnects using a self‑forming barrier layer

Cheol Kim, Geosan Kang, Youngran Jung, Ji‑Yong Kim, Gi‑Baek Lee, Deokgi Hong, Yoongu Lee, Soon‑Gyu Hwang, In‑Ho Jung, Young‑Chang Joo*

Scientific Reports, 2022, 12, 12291

2022

Interfacial Adhesion Energies of Uniformly Self‑Formed Cr2O3 Barriers for Advanced Co Interconnects

Seongi Lee, Soon‑Gyu Hwang, Gahui Kim, Cheol Kim, Woobin Kwon, Young‑Bae Park, Young‑Chang Joo*

Electronic Materials Letters, 2022, 18, 447–455