EN
KR

YOUNG-CHANG JOO

Professor, Materials Science and Engineering, Seoul National University

  • E-mail
ycjoo@snu.ac.kr
  • Phone
+82-2-880-8986
  • FAX
+82-2883-8197
  • Office
Room 33-211

Education

  • 1995
Ph. D: MIT, Department of Materials Science and Engineering
  • 1989
M.Sc : Seoul National University, Department of Metallurgical Engineering
  • 1987
B.S : Seoul National University, Department of Metallurgical Engineering

Research experiences

  • 1999.09 - Present
Professor, Department of Materials Science and Engineering, Seoul National University, Korea
  • 2006.01 - 2007.01
Visiting Professor, Stanford University, USA
  • 1997.12 - 1999.07
Senior Device Engineer, Advanced Micro Devices, Inc. (AMD), USA
  • 1995.02 - 1997.12
Visiting Scientist, Max-Planck-Institute for Metal Research, Germany

Awards

  • 19th Jungbu Yulgok Awards by Management Division of Public Institutions (2021)
  • LS Academic Awards by The Kroean Institute of Metals and Materials (2016)
  • Minister award by The Ministry of Science, ICT and Future Planning (2015)
  • Research Fellow by SBS Broadcasting (2012)
  • Achievement Award by Korea Semiconductor Industry Association (2012)
  • Haedong Research Award by Korean Electronic Packaging Society (2010)
  • Shinyang Awards by College of Engineering, Seoul National Univ. (2010)
  • Outstanding Presentation Award by European Symposium on Phase Change and Ovonic Science (2010)
  • YeonAm Professor Fellowship by LG-YeonAm Foundation (2005)
  • Young Scientist Award by Korean Institute of Metals and Materials (2004).
  • Best Teaching Award by College of Engineering, Seoul National University (2002, 2010).
  • Spotlight Award by Advanced Micro Devices, Inc. (AMD) (1999)
  • Korean Government Overseas Fellowship (1989-1992)
  • Iron and Steel Award by Pohang Iron and Steel Co., Ltd. (1987).
  • Alumni Award by College of Engineering, Seoul National University (1987

Professional activities

  1. Vice-Minister, for Science, Technology and Innovation of the Republic of Korea, Ministry of Science and ICT, 2022-2024
  2. President, The Advanced Institute of Convergence Technology, Korea, 2020-2022
  3. Member, National Academy of Engineering of Korea, 2022-
  4. Vice-Chairman,, The Korean Institute of Metals and Materials, 2022
  5. Chairman, Digital Transformation Committee (Gyeonggi-Province), 2022
  6. Vice-Chairman, The Korean Microelectronics & Packaging Society, 2019-2020
  7. Member, Competitiveness Committee on Materials, Parts and Equipment, 2019-2022
  8. Outside Director, LG Innotek Co., Ltd., 2019 -2022
  9. Department Chair, SNU Department of Materials Sci. and Eng. / BK Human Resources Development Group of Material Sciences and Engineering, Korea, 2017-2019
  10. General Leader, University Industrial Technology Force(UNITEF), Korea, 2017-2019
  11. Director of Material Research Society(MRS), USA, 2016-2018
  12. Director, SNU Center for Multi-scale testing and Assessment at Combined Environment, 2016
  13. Managing Member, Advanced Industrial Strategy Program, 2014-2015
  14. Technical Program Chair, IEEE-International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Songdo, Korea, 2011
  15. Advisory Board Member, SNU Engineering Consulting Center, 2010-2012
  16. Deputy Director, SNU Center for Teaching and Learning, 2010-2012
  17. General Chair, 2009 IEEE- International Interconnect Technology Conference (IITC), Sapporo, Japan
  18. Meeting Chair, 2008 Fall MRS Meeting, Boston, MA, USA
  19. Committee Member, ADMETA
  20. Symposium Organizer, 2007 TMS Annual Meeting, (Symposium: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VI), Orlando, USA.
  21. Symposium Organizer, International Conference on Processing and Manufacturing of Advanced Materials (THERMEC) 2006, Vancouver, Canada, (Advanced Thin Films and Nanomaterials)
  22. Symposium Organizer, Materials Research Society (MRS) 2006 Spring Meeting, San Francisco USA. (Materials, Technology, and Reliability for Copper Interconnects and Low-k Dielectrics)
  23. Symposium Organizer, Materials Research Society (MRS) 2003 Fall Meeting, Boston, USA (Symposium U:  Thin Films Stress and Mechanical Properties X)
  24. Symposium Organizer, Materials Research Society (MRS) 2000 Spring Meeting, San Francisco, USA (Symposium D; Materials, Technology, and Reliability for Advanced

Press release (the Advanced Institute of Convergence Technology related)

· http://www.kyeongin.com/main/view.php?key=20201027010005184
· https://www.kgnews.co.kr/news/article.html?no=623268
· http://www.joongboo.com/news/articleView.html?idxno=363471483
· https://www.etnews.com/20210311000114

Press release (research related)

· http://www.dhnews.co.kr/news/articleView.html?idxno=104425
· https://www.edaily.co.kr/news/read?newsId=01826966629083688&mediaCodeNo=257&OutLnkChk=Y
· https://www.hellot.net/news/article.html?no=48296
· https://www.newswire.co.kr/newsRead.php?no=925586

Invited conference presentations

  1. “Reliability of Bendable and Stretchable Electronic Devices under Cyclic Damage”, 2016 MRS Fall Meeting & Exhibit, USA
  2. “PEDOT:PSS Based Stretchable Conductor”, 2015 MRS Fall Meeting & Exhibit, USA
  3. “Mechanical and Electrical Reliability of Ag Interconnects Fabricated by Printing Methods for Highly Stable Wearable Devices”, The 11th Pacific Rim Conference of Ceramic Society, 2015, Korea
  4. “Phase stability and electrical properties of amorphous materials for electronic devices investingated by mechanical stress analysis”, ENGE 2014, Korea
  5. “Understanding the structural stability of amorphous phase GeSbTe through mechnical testing”, E\PCOS 2014, France
  6. “Origins of Atomic Transport and Suppression of Failures in Phase-Change Memory”, 2012 Material Research Society (MRS) Spring Conference, San Francisco, USA
  7. “Synchrotron measurement of Cu stresses in TSV structures”, Workshop for Stress Issues in Metallization 2012, Tokyo, Japan.
  8. “Highly reliable metal electrode for flexible/stretchable devices”, The 3rd International Workshop on Flexible & Printable Electronics (IWFPE) 2011, Muju, Korea
  9. “Electrical and Mechanical Reliability of 3-D Integrated Circuit Using Though-silicon Via (TSV)”, Advanced Metallization Conference 2011, Tokyo, Japan.
  10. “Residual Stress of Si near Through-Silicon-Via Structure for 3-Dimensional Packaging”, TMS 2011, San Diego, CA, USA.
  11. “Electric-field-enhanced atomic transport in phase change materials as the origin of the set-stuck failure in PRAM”, E\PCOS 2010, Milan, Italy.
  12. “Electromigration and Mechanical Properties of Chalcogenide Materials”, Gordon Research Conference 2010, ME, USA.
  13. “Electrical and Mechanical Reliability of Cu and Au Microbump for Fine Pitch Packaging”, The Japan Society of Applied Physics 2010 Spring Meeting, Kanazawa, Japan.
  14. “Reliability of Cu/Sn/Cu bonding for 3-D interconnects”, Advanced Metallization Conference 2008, Tokyo, Japan.
  15. “Cu-drift induced Dielectric Failure”, 2007 MRS Spring Meeting, San Francisco, CA.
  16. “Electromigration of Sn Based Alloy Solders: Incubation Time, Threshold Current Density and Driving Forces”, 2007 TMS Annual Meeting, Orlando, FL.
  17. “Cu Interconnect Voiding”, Advanced Metallization Conference 2005, Colorado Spring, CO, USA.
  18. “Electromigration of Solder materials”, 8th Intentional Workshop Stress Induced Phenomena in Metallization, 2005, Dresden, Germany.
  19. “Effect of Stress gradient on Stress-induced voids in Cu/low-k interconnects”, 3rd International Conference on Materials for Advanced Technology and 9th International Conference on Advanced Materials, 2005, Singapore.
  20. “Effect of Microstructure and Dielectric Materials on Stress-Induced Damages in Damascence Cu/Low-k Interconnects”, 2005 Spring MRS Meeting, (Symposium B : Materials, Technology, and Reliability for Advanced Interconnects and  Low-k Dielectrics) and (Symposium O : Thin Film – Stresses and Mechanical Properties XI)
  21. “Microstructure and Surface Damages during Thermal Annealing in Various Cu Films”, The 5th Pacific Rim International Conference on Advanced Materials and Processing, 2004, Beijing, China.
  22. “Stress and Stress-Induced Damage in Cu Interconnects”, 7th Intentional Workshop Stress Induced Phenomena in Metallization, 2004, Austin, TX, USA
  23. “Line width dependence of grain structure and stress in damascene Cu lines”, TMS 133rd Annual Meeting, 2004, Charlotte, NC, USA
  24. “Reliability of Cu/Low-k Interconnects”, Semicon Korea, 2004, Seoul, Korea.
  25. “Grain boundary characteristics and morphologies of stress-induced damage in electroplated and sputtered copper films”, 2003 THERMEC Conference, 2003, Madrid, Spain.
  26. “Electromigration in Single-Crystal Aluminum Interconnects”, 5th Intentional Workshop Stress Induced Phenomena in Metallization, 1999, Stuttgart, Germany

Invited conference presentations

  1. “Reliability of Bendable and Stretchable Electronic Devices under Cyclic Damage”, 2016 MRS Fall Meeting & Exhibit, USA
  2. “PEDOT:PSS Based Stretchable Conductor”, 2015 MRS Fall Meeting & Exhibit, USA
  3. “Mechanical and Electrical Reliability of Ag Interconnects Fabricated by Printing Methods for Highly Stable Wearable Devices”, The 11th Pacific Rim Conference of Ceramic Society, 2015, Korea
  4. “Phase stability and electrical properties of amorphous materials for electronic devices investingated by mechanical stress analysis”, ENGE 2014, Korea
  5. “Understanding the structural stability of amorphous phase GeSbTe through mechnical testing”, E\PCOS 2014, France
  6. “Origins of Atomic Transport and Suppression of Failures in Phase-Change Memory”, 2012 Material Research Society (MRS) Spring Conference, San Francisco, USA
  7. “Synchrotron measurement of Cu stresses in TSV structures”, Workshop for Stress Issues in Metallization 2012, Tokyo, Japan.
  8. “Highly reliable metal electrode for flexible/stretchable devices”, The 3rd International Workshop on Flexible & Printable Electronics (IWFPE) 2011, Muju, Korea
  9. “Electrical and Mechanical Reliability of 3-D Integrated Circuit Using Though-silicon Via (TSV)”, Advanced Metallization Conference 2011, Tokyo, Japan.
  10. “Residual Stress of Si near Through-Silicon-Via Structure for 3-Dimensional Packaging”, TMS 2011, San Diego, CA, USA.
  11. “Electric-field-enhanced atomic transport in phase change materials as the origin of the set-stuck failure in PRAM”, E\PCOS 2010, Milan, Italy.
  12. “Electromigration and Mechanical Properties of Chalcogenide Materials”, Gordon Research Conference 2010, ME, USA.
  13. “Electrical and Mechanical Reliability of Cu and Au Microbump for Fine Pitch Packaging”, The Japan Society of Applied Physics 2010 Spring Meeting, Kanazawa, Japan.
  14. “Reliability of Cu/Sn/Cu bonding for 3-D interconnects”, Advanced Metallization Conference 2008, Tokyo, Japan.
  15. “Cu-drift induced Dielectric Failure”, 2007 MRS Spring Meeting, San Francisco, CA.
  16. “Electromigration of Sn Based Alloy Solders: Incubation Time, Threshold Current Density and Driving Forces”, 2007 TMS Annual Meeting, Orlando, FL.
  17. “Cu Interconnect Voiding”, Advanced Metallization Conference 2005, Colorado Spring, CO, USA.
  18. “Electromigration of Solder materials”, 8th Intentional Workshop Stress Induced Phenomena in Metallization, 2005, Dresden, Germany.
  19. “Effect of Stress gradient on Stress-induced voids in Cu/low-k interconnects”, 3rd International Conference on Materials for Advanced Technology and 9th International Conference on Advanced Materials, 2005, Singapore.
  20. “Effect of Microstructure and Dielectric Materials on Stress-Induced Damages in Damascence Cu/Low-k Interconnects”, 2005 Spring MRS Meeting, (Symposium B : Materials, Technology, and Reliability for Advanced Interconnects and  Low-k Dielectrics) and (Symposium O : Thin Film – Stresses and Mechanical Properties XI)
  21. “Microstructure and Surface Damages during Thermal Annealing in Various Cu Films”, The 5th Pacific Rim International Conference on Advanced Materials and Processing, 2004, Beijing, China.
  22. “Stress and Stress-Induced Damage in Cu Interconnects”, 7th Intentional Workshop Stress Induced Phenomena in Metallization, 2004, Austin, TX, USA
  23. “Line width dependence of grain structure and stress in damascene Cu lines”, TMS 133rd Annual Meeting, 2004, Charlotte, NC, USA
  24. “Reliability of Cu/Low-k Interconnects”, Semicon Korea, 2004, Seoul, Korea.
  25. “Grain boundary characteristics and morphologies of stress-induced damage in electroplated and sputtered copper films”, 2003 THERMEC Conference, 2003, Madrid, Spain.
  26. “Electromigration in Single-Crystal Aluminum Interconnects”, 5th Intentional Workshop Stress Induced Phenomena in Metallization, 1999, Stuttgart, Germany

Publications

  1. H.-R. Lee, J.-S. Woo, S.-H. Han, S.-M. Lim, S.-S. Lim, Y.-W. Kang, W.-J. Song, J.-M. Park, T.-D. Chung, Y.-C. Joo, and J.-Y. Sun,  “A Stretchable Ionic Diode from Copolyelectrolyte Hydrogels with Methacrylated Polysaccharides”, Advanced Functional Materials, 1806909 (2018)
  2. K.-T. Jang, S.-Y. Lee, S.-K. Na, S.-K. Lee, J.-M. Baek, W.-K. You, O.-H. Park, R.-H. Kim, H.-S. Oh, and Y.-C. Joo,  “Electromigration Characteristcs and Morphological Evolution of Cu Interconnects on CVD Co and Ru Liners for 10-nm Class VLSI Technology”, IEEE Electronic Device Letters, 29(7) (2018)
  3. M.-W. Jeong, S.-K. Na, H.-S. Shin, H.-B. Park, H.-J. Lee, and Y.-C. Joo,  “Thermomechanical In Situ Monitoring of Bi2Te3 Thin Film and Its Relationship with Microstructure and Thermoelectric Performances”, Electronic Materials Letters, 14 (2018)
  4. S.-M. Yi, I.-S. Choi, B.-J. Kim, Y.-C. Joo,  “Reliability Issues and Solutions In Flexible Electronics Under Mechanical Fatigue”, Electronic Materials Letters, 387 (2018)
  5. S.-K. Lee, K.-T. Jang, S.-M. Yi, Y.-C. Joo,  “Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bais stress”, IEEE International Reliability Physics Symposium (IRPS), 4A.5 (2018)
  6. D.-H. Nam, R. Abdur, Y.-C. Joo, J.-I. Jang, P.-R. Cha, J.-Y. Kim, K.-S. Min, and J.-G. Lee,  “Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV: Diffusion barrier, adhesion, conformal coating, and mechanical property”, Materials Science in Semiconductor Processing, 83 (2018)
  7. I.-K. Ahn, Y.-J. Lee, S.-K. Na, S.-Y. Lee, D.-H. Nam, J.-H. Lee, and Y.-C. Joo, “Improved Battery Performance of Nanocrystalline Si Anodes Utilized by Radio Frequency (RF) Sputtered Multifunctional Amorphous Si Coating Layers”, ACS Applied Materials & Interfaces, 10 (2018)
  8. K.-T. Jang, J.-S. Hwang, Y.-J. Park, J.-C. Lee, N.-R. Kim, J.-W. Yu, and Y.-C. Joo, “Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles”, RSC Advances, 9719, (2017)
  9. D.-H. Nam, H.-Y. Kang, J.-H. Jo, B.-K. Kim, S.-K. Na, U. Sim, I.-K. Ahn, K.-W. Yi, K.-T. Nam, and Y.-C. Joo, “Controlled Molybdenum Disulfide Assembly inside Carbon Nanofiber by Boudouard Reaction Inspired Selective Carbon Oxidation”, Advanced Materials, 1605327, (2017)
  10. H.-W. Yeon, J.-H. Jo, H.-C. Song, Y.-H. Kang, S.-K. Na, H.-B. Yoo, S.-Y. Lee, H.-L. Cho, H.-Y. Kang, J.-K. Jung, S.-W. Han, M.-Y. Kim, Y.-C. Joo, “Cu Diffusion-Driven Dynamic Modulation of the Electrical Properties of Amorphous Oxide Semiconductors”, Advanced Functional Materials, 1700336, (2017)
  11. D.-H. Nam, S.-W. Lee, Y.-J. Lee, J.-H. Jo, E.-J. Yoon, K.-W. Yi, G.-D. Lee, and Y.-C. Joo, “Gaseous Nanocarving-Mediated Carbon Framework with Spontaneous Metal Assembly for Structure-Tunable Metal/Carbon Nanofibers”, Advanced Materials, 1702958, (2017)
  12. Y.-Y. Lee, H.-Y. Kang, S.H. Gwon, G.M. Choi, S.-M. Lim, J.-Y. Sun, and Y.-C. Joo, “A Strain-Intensive Stretchable Electronic Conductor: PEDOT-PSS/Acrylamide Organogels”, Advanced Materials, 28(1636) (2016)
  13. H.-W. Yeon, S.-M. Lim, J.-K. Jung, Hyobin Yoo, Y.-J. Lee, H.-Y. Kang, Y.-J. Park, Miyoung Kim, and Y.-C. Joo, “Structural-Relaxation-Driven Electron Doping in Amorphous Oxide Semiconductors through the Increase in Concentration of Oxygen Vacancies in the Shallow-Donor State”, NPG Asia Materials, 8(e250) (2016)
  14. Y.-J. Park, J.-Y. Cho, M.-W. Jeong, Sekwon Na, and Y.-C. Joo, “New Pathway for the Formation of Metallic Cubic Phase Ge-Sb-Te Compounds Induced by an Electric Current”, Scientific Reports, 6(21466) (2016)
  15. K.-T. Jang, Y.-J. Park, M.-W. Jeong, S.-M. Lim, H.-W. Yeon, J.-Y. Cho, M.-G. Jin, J.-S. Shin, B.-W. Woo, J.-Y. Bae, Y.-C. Hwang, and Y.-C. Joo, “Electromigration behavior of advanced metallization on the structural effects for memory devices”, Microelectronic Engineering Corresponding, 156(97) (2016)
  16. Sekwon Na, T.-y. Eom, Y.-C. Joo, and H.-J. Lee, “Effects of the Mo composition of Mo-alloyed Yb/Si contacts: microstructure evolution and electrical properties”, Japanese Journal of Applied Physics, 55(6S3) (2016)
  17. Y.-Y. Lee, G.M. Choi, S.-M. Lim, J.-Y. Cho, I.-S. Choi, K.T. Nam and Y.-C. Joo, “Growth Mechanism of Strain-Dependent Morphological Change in PEDOT:PSS Films”, Scientific Reports, 6(25332) (2016)
  18. B.-J. Kim, H.-A-S. Shin, J.-H. Lee, and Y.-C. Joo, “Effect of cyclic outer and inner bending on the fatigue behavior of a multi-layer metal film on a polymer substrate”, Japanese Journal of Applied Physics, 55(6S3) (2016)
  19. S.H. Kwak, S.-R. Kwon, S. Baek, S.-M. Lim, Y.-C. Joo, and T.D. Chung, “Densely charged polyelectrolyte-stuffed nanochannel arrays for power generation from salinity gradient”, Scientific Reports, 6(26416) (2016)
  20. S.S. Shin, W.S. Yang, E.J. Yeom, S.J. Lee, N.J. Jeon, Y.-C. Joo, I.J. Park, J.H. Noh, and S.I. Seok, “Tailoring of Electron-Collecting Oxide Nanoparticulate Layer for Flexible Perovskite Solar Cells”, J. Phys. Chem. Lett. 7(10) (2016)
  21. Jiwoo Yu, D.-H. Nam, Y.-J. Lee, and Y.-C. Joo, “Electrospun Magnetic Nanofiber as Multifunctional Flexible EMI-Shielding Layer and its Optimization on the Effectiveness”, Journal of the Microelectronics and Packaging Society, 23(2) (2016)
  22. H.-W. Yeon, J.-Y. Song, S.-M. Lim, and Y.-C. Joo, “Effect of pulsed electric fields on dielectric breakdown in Cu damascene interconnects”, Applied Physics Express 8 (2015)
  23. D.-H. Nam, J.W. Kim, J.-H. Lee, S.-Y. Lee, H.-A-S. Shin, S.-H. Lee, and Y.-C. Joo, “Tunable Sn Structures in Porosity-Controlled Carbon Nanofibers for All-Solid-State Lithium-Ion Battery Anodes”, Journal of Materials Chemistry A 3 (2015)
  24. J.-Y. Cho, D.H. Kim, Y.-J. Park, T.-Y. Yang, Y.-Y. Lee, and Y.-C. Joo, “The phase-change kinetics of amorphous Ge2Sb2Te5 and device characteristics investigated by thin-film mechanics”, Acta Materialia 94 (2015)
  25. J.-H. Lee, J.W. Kim, H.-Y. Kang, S.C. Kim, S.S. Han, K.H. Oh, S.-H. Lee, and Y.-C. Joo, “The effect of energetically coated ZrOx on enhanced electrochemical performances of Li(Ni1/3Co1/3Mn1/3)O2 cathodes using modified radio frequency (RF) sputtering”, Journal of Materials Chemistry A 24 (2015)
  26. Y.-J. Lee, H.-A.-S. Shin, D.-H. Nam, H.-W. Yeon, B.A. Nam, K.H. Woo, and Y.-C. Joo, “Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer”, Electronic Materials Letters 11(1) (2015)
  27. B.-J. Kim, Thomas Haas, Andreas Friederich, J.-H. Lee, D.-H. Nam, Joachim R Binder, Werner Bauer, I.-S. Choi, Y.-C. Joo, Patric A Gruber, and Oliver Kraft, “Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices”, Nanotechnology 25(12) (2014)
  28. J.-H. Lee, T.-Y. Yang, H.-Y. Kang, D.-H. Nam, N.-R. Kim, Y.-Y. Lee, S.-H. Lee, and Y.-C. Joo, “Designing Thermal and Electrochemical Oxidation Processes for δ-MnO2 Nanofibers for High-performance Electrochemical Capacitors”, Journal of Materials Chemistry A 20 (2014)
  29. J.R. Hong, S.G. Lee, H.T. Han, Chandreswar Mahata, H.-W. Yeon, B.-W. Koo, S.-I. Kim, T.W. Nam, B.-W. Min, Y.-C. Joo, Y.-W. Kim, H.J. Kim, and T.Y. Lee, “Graphene as an atomically thin barrier to Cu diffusion into Si”, Nanoscale 6(13) (2014)
  30. J.-Y. Cho, T.-Y. Yang, Y.-J. Park, Y.-Y. Lee, and Y.-C. Joo, “Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis”, ECS Solid-State Letters 3(6) (2014)
  31. H.-A.-S. Shin, J.C. Ryu, S.M. Cho, B.H. Hong, and Y.-C. Joo, “Graphene-induced Unusual Microstructural Evolution in Ag plated Cu Foils”, Nanoscale 6(13) (2014)
  32. B.I. Hwang, H.-A.-S. Shin, T.G. Kim, Y.-C. Joo, and S.M. Han, “Highly Reliable, Flexible and Transparent Ag Nanowire Electrode with Mechanically Welded Junctions”, Small 10(16) (2014)
  33. M.-S. Jung, J.-H. Seo, M.-W. Moon, J.W. Choi, Y.-C. Joo, and I.-S. Choi, “A Bendable Li-Ion Battery with a Nano-Hairy Electrode: Direct Integration Scheme on the Polymer Substrate”, Advanced Energy Materials 5(1) (2014)
  34. B.-J. Kim, H.-A.-S. Shin, J.-H. Lee, T.-Y. Yang, Thomas Haas, Patric Gruber, I.-S. Choi, Oliver Kraft, and Y.-C. Joo, “Effect of Film Thickness on Stretchability and Fatigue Resistance of Cu Film on Polymer Substrate”, Journal of Materials Research 29(23) (2014)
  35. B.J. Kim, D.H. Kim, Y.-Y. Lee, H.-W. Shin, G.S. Han, J.S. Hong, Khalid Mahmood, T.K. Ahn, Y.-C. Joo, K.S. Hong, N.-G. Park, S.W. Lee, and H.S. Jun, “Highly Efficient and Bending Durable Perovskite Solar Cells: Toward Wearable Power Source”, Energy & Environmental Science 8 (2014)
  36. D.-H. Nam, J.-H. Lee, N.-R. Kim, Y.-Y. Lee, H.-W. Yeon, S.-Y. Lee, and Y.-C. Joo, “One-Step Structure Modulation of Electrospun Metal-loaded Carbon Nanofibers: Redox Reaction Controlled Calcination”, Carbon 82 (2014)
  37. Y. W. Chung, S.G. Lee, Chandreswar Mahata, J.M. Seo, S.-M. Lim, M.-s. Jeong, H.E. Jung, Y.-C. Joo, Y.-B. Park, H.J. Kim, and T.Y. Lee, “Coupled Self-assembled Monolayer for Enhancement of Cu Diffusion Barrier and Adhesion Properties”, RSC Advances 4 (2014)
  38. S.-M. Yi, and Y.-C. Joo, “The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment”, J. Microelectron. Packag. Soc. 21(4) (2014)
  39. H.-W. Yeon, J.-Y. Song, S.-M. Lim, J.-Y. Bae, Y. Hwang, and Y.-C. Joo, “Effect of Dynamic Electric Fields on Dielectric Reliability in Cu Damascene Interconnects”, J. Microelectron. Packag. Soc. 21(4) (2014)
  40. Y.-J. Lee, H.-W. Yeon, H.-A-S. Shin, Y.-W. Lee, Louise A. Evans, Y.-C.Joo, “Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics”, Appl. Phys. Lett., 103(24), p. 241904 (2013)
  41. S.-H. Kim, Y.-J. Park, Y.-C. Joo, Y.-B. Park, “High current density effect on in-situ atomic migration characteristics of a BiTe thin film system”, Jap. J. Appl. Phys., 52(108), p.10MC06 (2013)
  42. N.-R. Kim, J.-H. Lee, Y.-Y. Lee, D.-H. Nam, H.-W. Yeon, A.-R. Chu, K.-T. Nam, Y.-C. Joo, “Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing”, J. Mat. Chem. C, 37(1), pp.5953-5959 (2013)
  43. Y.-J. Park, T.-Y. Yang, J.-Y. Cho, S.-Y. Lee, Y.-C. Joo, “Electrical current-induced gradual failure of crystalline Ge2Sb2Te5 for phase-change memory” Appl. Phys. Lett., 103(7), p. 73503 (2013)
  44. B.-J. Kim, H.-A-S. Shin, S.-Y. Jung, I.-G. Cho, I.-S. Choi, Y.-C. Joo, Oliver Kraft, “Crack nucleation during mechanical fatigue in thin metal films on flexible substrates”, Acta Mater., 61(9), pp. 3473-3481 (2013)
  45. T.-Y. Yang, H.-Y. Kang, Y.-J. Lee, J.-H. Lee, U. Shim, B.-J. Koo, K.-T. Nam, Y.-C. Joo, “A new hematite photoanode doping strategy for solar water splitting: oxygen vacancy generation”, Phys. Chem. Chem. Phys., 15(6), pp. 2117-2124 (2013)
  46. Y.-Y. Lee, J.-H. Lee, J.-Y. Cho, N.-R. Kim, D.-H. Nam, K.-T. Nam, I.-S. Choi, Y.-C. Joo, “Stretching-Induced Growth of PEDOT-Rich Cores: A New Mechanism for Strain-Dependent Resistiity Change in PEDOT:PSS Films”, Adv. Funct. Mater., 23(32), pp. 4020-4027 (2013)
  47. C.-K. Lee, Y.-J. Lee, S.-Y. Park, H.-Y. Jung, C.-K. Lee, M.-G. Son, H.-J. Kim, Y.-C. Joo, J.-K. Jung, “Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing”, Physical Status Solidi (RRL) – Rapid Research Letters, 7(3), pp. 196-198 (2013)
  48. B.-J. Kim, H.-A-S. Shin, I.-S. Choi, Y.-C. Joo, “Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array”, Small, 8(21), pp. 3300-3306 (2012)
  49. M.-S. Jung, S.-B. Lee, H.-Y. Lee, C.-S. Ryu, Y.-G. Ko, H.-W. Park and Y.-C. Joo, “Improvement of Electrochemical Migration Resistance by Cu/Sn Inter-Metallic Compound Barrier on Cu in Printed Circuit Board”, IEEE Transactions on Device and Materials Reliability, in press, (2012)
  50. S. Sen, T. G. Edwards, J.-Y. Cho, and Y.-C. Joo “Te-Centric View of the Phase Change Mechanism in Ge-Sb-Te Alloys”, Phys. Rev. Lett., 108(19), p. 165506 (2012)
  51. J.-R. Yim, S.-Y. Jung, H.-W. Yeon, J.-Y. Kwon, Y.-J. Lee, J.-H. Lee, Y.-C. Joo, “Effects of Metal Electrode on the Electrical Performance of Amorphous In–Ga–Zn–O Thin Film Transistor”, Jap. J. Appl. Phys., 51(1), p. 011401 (2012)
  52. D.-K. Kim, S.-J. Hwang, and Y.-C. Joo, “Failure Mechanisms of W/TiN/Ti Metal Lines under High Current Stressing”, Appl. Phys. Express, 5(2), p. 025801 (2012)
  53. S.-H. Hwang, B.-J. Kim, H.-Y. Lee, and Y.-C. Joo, “Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits”, J. Elect. Mat., 41(2) pp. 232-240 (2012)
  54. A.S. Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, and Y.-C. Joo, “Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits”, Microelectron. Reliab. 52(3), pp. 530-533 (2012)
  55. T.-Y. Yang, J.-Y. Cho, Y.-J. Park, Y.-C. Joo, “Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude electrical-pulse”, Acta.Mater., 60(5), pp. 2012-2030 (2012)
  56. J.-Y. Cho, T.-Y. Yang, Y.-J. Park and Young-Chang Joo, “Study on the Resistance Drift in Amorphous Ge2Sb2Te5 According to Defect Annihilation and Stress Relaxation”, Electrochem. Solid. St., 15(4), pp. H81-H83 (2012)
  57. H.-A.-S. Shin, B.-J. Kim, J.-H. Kim, S.-H. Hwang, A. S. Budiman, H.-Y. Son, K.-Y. Byun, N. Tamura, M. Kunz, D.-I. Kim, Y.-C. Joo, “Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing”, J. Electron. Mater., 41(4), pp.712-719 (2012)
  58. H.-W. Yeon, S.-Y. Jung, J.-R. Lim, J.-W. Pyun, H.-W. Kim, D.-H. Baek and Y.-C. Joo, “Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress”, Electrochem. Solid. St., 15(5), pp. H157-H160 (2012)
  59. J.-H. Lee, N.-R. Kim, B.-J. Kim, and Y.-C. Joo, “Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with oxygen-pressure-controlled annealing”, Carbon, 50(1), pp. 98-106 (2012).
  60. S.-Y. Jung, B.-J. Kim, N.-Y. Lee, B.-M. Kim, S.-J. Yeom, N.-J. Kwak, and Y.-C. Joo, “Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects”, Microelectron. Eng., 89(1), pp. 58-61 (2012).
  61. S.-B. Lee, H.-Y. Lee, M.-S. Jung, Y.-B. Park, and Y.-C. Joo, “Effect of the Composition of Sn-Pb Alloys on the Microstructure of Filaments and the Electrochemical Migration Characteristics”, Met. Mater-Int., 17(4), pp. 617-621 (2011).
  62. N.-R. Kim, J.-H. Lee, S.-M. Yi, and Y.-C. Joo, “Highly Conductive Ag Nanoparticulate Films Induced by Movable Rapid Thermal Annealing Applicable to Roll-to-Roll Processing”, J. Electroch. Soc., 158(8), pp. K165-K169 (2011).
  63. I.-M. Park, J.-Y. Cho, T.-Y. Yang, E.-S. Park, and Y.-C. Joo, “Thermomechanical Analysis on the Phase Stability of Nitrogen-Doped Amorphous Ge2Sb2Te5 Films”, Jap. J. Appl. Phys., 50(6), p. 061201 (2011).
  64. S.-B. Lee, H.-Y. Lee, E. Lee, W. Lee, and Y.-C. Joo, “Fabrication of a Hydrogen Sensor using Palladium-coated Silver Dendrites Formed Electrochemically”, Met. Mater-Int., 16(5), pp. 789-792 (2010).
  65. S.-M. Yi, J.-H. Lee, N.-R. Kim, S. Oh, S. Jang, D. Kim, J. Joung, and Y.-C. Joo, “Improvement of Electrical and Mechanical Properties of Ag Nanoparticulate Films by Controlling the Oxygen Pressure”, J. Electroch. Soc., 157(12), pp. K254-K259 (2010).
  66. H.-Y. Lee, S.-M. Yi, J.-H. Lee, H.-S. Lee, S. Hyun, and Y.-C. Joo, “Effects of Bending Fatigue on the Electrical Resistance in Metallic Films on Flexible Substrates”, Met. Mater-Int., 16(6), pp. 947-951 (2010).
  67. M.-H. Jeong, G.-T. Lim, B.-J. Kim, J. Kim, K. Lee, Y.-C. Joo, and Y.-B. Park, “Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps”, J. Elec. Mat., 39(10), pp. 1-7 (2010).
  68. T.-Y. Yang, J.-Y. Cho, and Y.-C. Joo, “Inhibition of the electrostatic force-induced atomic migration in Ge2Sb2Te5 by nitrogen doping”, Electrochem. Solid-State Lett., 13 (9), pp. H321-H323 (2010).
  69. B.-J. Kim, G.-T. Lim, J. Kim, K. Lee, Y.-B. Park, H.-Y. Lee, and Y.-C. Joo, “Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing”, J. Elec. Mat., Article in Press, pp. 1-5 (2010).
  70. Y.-H. Yoon, S.-M. Yi, J.-R. Yim, J.-H. Lee, and Y.-C. Joo, “Microstructure and electrical properties of high power laser thermal annealing on inkjet-printed Ag films”, Microelectron. Eng. 87 (11), pp. 2230-2233 (2010).
  71. S.-B. Lee, M.-S. Jung, H.-Y. Lee, T. Kang, and Y.-C. Joo, “Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb”, IEEE Trans. Rel. 9 (3) pp. 483 (2009).
  72. I.-M. Park, S.-J. Hwang, J.-H. Lee, and Y.-C. Joo, “Effect of effective modulus on hillock formations in al lines on glass”, Met. Mater-Int. 15 (4), pp. 661 (2009).
  73. T.-Y. Yang, I.-M. Park, B.-J. Kim, and Y.-C. Joo, “Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field”, Appl. Phys. Lett. 95, pp. 032104 (2009).
  74. T.-Y. Yang, I.-M. Park, H.-Y. You, S.-H. Oh, K.-W. Yi, and Y.-C. Joo, “Change of Damage Mechanism by the Frequency of Applied Pulsed DC in the Ge2Sb2Te5 Line”, J. Electroch. Soc. 156, H617 (2009).
  75. J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, and Y.-B. Park, “Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions”, J. Elec. Mat. 38, pp.691-699 (2009).
  76. A.S. Budiman, P.R. Besser, C.S. Hau-Riege, A. Marathe, Y.-C. Joo, N. Tamura, J.R. Patel, and W.D. Nix, “Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment”, J. Elec. Mat. 38, pp.379-391 (2009).
  77. H.-Y. Lee, S.-J. Suh, S.-R. Kim, S.-Y. Park, Y.-C. Joo, “Measurement of Poisson’s Ratio of a Thin Film on a Substrate by Combining X-Ray Diffraction with in situ Substrate Bending”, Elec. Mat. Lett. 5, pp. 51-54 (2009).
  78. J.-R. Yim, A.-R. Min, and Y.-C Joo, “Quantitative Analysis of the Size Distributions and Elements of the Precipitates in Fe-3%Si Alloy during Secondary Recrystallization Annealing using HAADF Imaging and XEDS”, Met. Mater-Int. 15(1), pp. 113 (2009)
  79. I.-M. Park, T.-Y. Yang, S. W. Jung, Y. K. Kim, H. Horii, Y.-C. Joo, “Investigation of crystallization behaviors of nitrogen-doped Ge2Sb2Te5 films by thermomechanical characteristics”, Appl. Phys. Lett. 94, pp. 061904 (2009).
  80. I.-M. Park, J.-K. Jung, S.-O. Ryu, K.-J. Choi, B.-G. Yu, Y.-B. Park, S.-M. Han, Y.-C. Joo, “Thermomechanical Properties and Mechanical Stresses of Ge2Sb2Te5 Films in Phase-Change Random Access Memory”, Thin Solid Films 517(2), pp. 848 (2008).
  81. H. Kwon, S.-S. Jang, Y.-H. Park, T.-S. Kim, Y.-D. Kim, H.-J. Nam, Y.-C. Joo, “Investigation of the electrical contact behaviors in Au-to-Au thin-film contacts for RF MEMS switches”, J. Micromech. Microeng. 18(10), pp. 105010 (2008).
  82. S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “Characteristics of Leakage Current in the Dielectric Layer due to Cu Migration during Bias Temperature Stress”, J. Appl. Phys. 104(4), pp. 044511 (2008).
  83. S.-J. Hwang, Y.-C. Joo, J. Koike, “Stress Relaxation during Isothermal Annealing in Electroplated Cu Films”, Thin Solid Films 516(21), pp. 7588-7594 (2008).
  84. H. Kwon, J.-H. Park, H.-C. Lee, D.-J. Choi, Y.-H. Park, H.-J. Nam, Y.-C. Joo, “Investigation of Similar and Dissimilar Metal Contacts for Reliable Radio Frequency Micorelectromechanical Switches”, Jap. J. Appl. Phys. 47(8), pp. 6558 (2008).
  85. J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park, “Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions”, J. Elec. Mat., 37(8), pp.1111 (2008)
  86. J.-Y. Jung, S.-B. Lee, Y.-C. Joo, H.-Y. Lee and Y.-B. Park, “Anodic Dissolution Characteristics and Electrochemical Migration Lifetimes of Sn Solder in NaCl and Na2SO4 solutions”, Microelectron. Eng. 85(7), pp. 1597 (2008)
  87. Lucas A. Berla, Y.-C. Joo, William D. Nix, “A Model for Power Law Creep Controlled Hillock Growth”, Mat. Sci. Eng. A 488, pp. 594 (2008)
  88. K.-H. Jang , S.-J. Hwang , Y.-C. Joo, “Effect of capping layer on hillock formation in thin Al films”, Met. Mater-Int. 14(2), pp. 147 (2008)
  89. S.-M. Yi, K.-Ho Jang, J.-U. An, S.-S. Hwang, and Y.-C. Joo, “The self-formatting barrier characteristics of Cu-Mg/SiO2 and Cu-Ru/SiO2 films for Cu interconnects”, Microelectron. Reliab. 48(5), pp. 744 (2008)
  90. I.-M. Park, J.-K. Jung, T.-Y. Yang, Y.-C. Joo, “Effect of Nitrogen Implantation with Low Dose on Thermomechanical Properties and Microstructure of Ge2Sb2Te5 Films”, Jap. J. Appl. Phys. 47(3), pp. 1491 (2008).
  91. M.-S. Yoon, M.-K. Ko, B.-N. Kim, and B.-J. Kim, Y.-B. Park, Y.-C. Joo, “Line length dependence of threshold current density and driving force in eutectic SbPb and SnAgCu solder electromigraion”, J. Appl. Phys. 103(7), pp. 073701 (2008).
  92. S.-M. Yi, J.-U. An, S.-S. Hwang, J.-R. Yim, Y.-H. Huh, Y.-B. Park and Y.-C. Joo, “Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability”, Thin Solid Films 516(8), pp. 2325 (2008)
  93. S.-M. Yi, C. Shim, H.-C. Lee, J.-W. Han, K.-H. Kim and Y.-C. Joo, “Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects”, Microelectron. Eng. 85(3), pp. 621 (2008)
  94. J.-K. Jung, S.-H. Choi, I. Kim, H. C. Jung, J. Joung, Y.-C. Joo, “Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air”, Philos. Mag. 88(3), pp. 339 (2008)
  95. H.-W Kim, J.-W. Lee, W.-S. Hwang, B.-H. O, S.-G. Lee, S.-G. Park, J. Kim, D. J. Chung, S. P. Chang, Y.-C. Joo, J. Joo, C. W. Chung, W. J. Park, C.-J. Kang, S. Joo, S. O. Park, C.-G. Yoo, S. K. Kim, J. H. Lee, S.-D. Cho, D.-K. Choi, K. Kim and J.-Y. Jang, “Etching characteristics of photoresist and low-k dielectrics by Ar/O-2 ferrite-core inductively coupled plasmas”, Microelectron. Eng. 85(2), pp. 300 (2008)
  96. S.-W. Chen, S. Chada, C.-M Chen, A. L. Greer, Y.-C. Joo, H.-M Lee, D. J. Lewis and K. Suganuma, “Phase stability, phase transformation and reactive phase formation in electronic materials VI – Foreword”, J. Elec. Mat. 36(11), pp. 1407 (2007)
  97. S.-J. Hwang, W. D. Nix, Y.-C. Joo, “A model for hillock growth in Al thin films controlled by plastic deformation”, Acta Mat. 55, pp. 5297 (2007).
  98. H. Kwon, Y. Yee, S.-H. Kim, J.-M. Ha, S.-C. Kim, K.-C. Song, K.-Y. Um, Y.-C. Joo, H.-J. Nam, and J.-U. Bu, “Micro-optical fiber coupler on silicon bench based on microelectromechanical systems technology”, Jap. J. Appl. Phys. 46(8B), pp. 5473 (2007).
  99. H.-W. Kim, S.-H Shim, J.-W Lee, C.-M Lee, H.-J. Hwang, S.-Y. Chung, H.-S. Kim, S.-K. Hwang, G.-Y. Yeom, N.-E. Lee, J.-B. Yoo, Y.-C. Joo, H.-J. Kim, E.-J. Yoon, “Synthesis, structural characterization and photoluminescence properties of SiOx nanowires prepared using a palladium catalyst”, J. Korean Phys. Soc. 50(6), pp.1799 (2007)
  100. M.-S. Yoon, M.-K. Ko, O.-h. Kim, Y.-B. Park, W.D. Nix, Y.-C. Joo, “In-situ observation of electromigraion in eutectic SnPb solder lines : Atomic migraion and hillock formation”, J. Elec. Mat., 36, pp.562 (2007).
  101. S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits”, J. Appl. Phys. 101, pp. 074501 (2007).
  102. S.-J. Hwang, J.-H. Lee, C.-O. Jeung, and Y.-C. Joo, “Effect of film thickness and anealing temperature on hilloock distributions in pure Al films”, Scripta Mater. 56, pp.17 (2007).
  103. K.-S. Kim, Y.-C. Joo, K.-B. Kim, and J.-Y. Kwon, “Extraction of Cu diffusivities in dielectric materials by numerical calculation and capacitance-voltage measurement”, J. Appl. Phys. 100, pp. 063517 (2006).
  104. M.-S. Yoon, S.-B. Lee, O.-H. Kim, Y.-B. Park, and Y.-C. Joo, “Relationship between edge drift and atomic migration during electromigration of eutectic SnPb lines”, J. Appl. Phys. 100, pp. 33715 (2006).
  105. J.-M. Paik, I.-M. Park, and Y.-C. Joo, “Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI”, Thin Solid Films 504, pp. 294 (2006).
  106. S.-J. Hwang, Y.-C. Joo, Y.-D. Lee, Y.-B. Park, J.-H. Lee, and C.-O. Jeong, “In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing”, Scripta Mater. 54, pp.1841 (2006).
  107. J.-M. Paik, I.-M. Park, K.-C. Park, and Y.-C. Joo, “Line Width Dependence of Grain Structure and Stress in Damascene Cu Lines for ULSI”, J. Appl. Phys. 99, pp 024509 (2006).
  108. S.-H. Kim, H.-J. Sohn, Y.-C. Joo, Y.-W. Kim, T.-H. Yim, H.-Y. Lee, T. Kang, “Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy”, Surf. Coat. Tech. 199, pp.43 (2005).
  109. B.-S. Jeon, K.-J. Park, S.-J. Song, Y.-C. Joo, K.-D Min, “Design, Fabrication, and Testing of a MEMS Microturbine”, J. Mech. Sci. Technol. 19, pp. 682 (2005).
  110. S.-J. Hwang, J. Koike, and Y.-C. Joo, “Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures”, Materials Science Forum, (2005).
  111. S.-S. Hwang, H.-C. Lee, H.-W. Ro, D. Y. Yoon and Y.-C. Joo, “Effect of pore interconnection on Cu-diffusion-induced failures in porous spin-on low-k dielectrics”, Appl. Phys. Lett. 87, pp. 111915 (2005).
  112. J.-M. Paik, K.-C. Park, H. Park, and Y.-C. Joo, “Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines”, J. Appl. Phys. 97, pp. 104513 (2005).
  113. J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo, “Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness”, J. Elec. Mat., 34, pp.559 (2005).
  114. J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park, “Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness”, Jap. J. Appl. Phys. 43, (2004).
  115. H. Park, S.-J. Hwang, Y.-C. Joo, “Stress-induced Surface Damages and Grain Boundary Characteristics of in Sputtered and Electroplated Copper Thin Films”, Acta Mat. 52, pp 2435-2440 (2004).
  116. H.-S. Min, O.-S. Song, Y.-C. Joo, “Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding”, J. of Electronic Packaging, 126, pp.120-123 (2004).
  117. H. Park, N.-M. Hwang, Y.-C. Joo, D.-Y. Kim, C. H. Han, J.-K. Kim, “Microstructural Evidences of Abnormal Grain Growth by Solid-state Wetting in Fe-3%Si Steel”, J. Appl. Phys. (2004).
  118. J.-M.Paik, H. Park and Y.-C. Joo, “Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects”, Microelectronic Eng. 71, pp.348-357 (2004).
  119. J.-M.Paik, K.-C. Park, and Y.-C. Joo, “Relationship between Grain Structures and Texture of Damascene Cu Lines”, J. Elec. Mat. l33, pp.48-52 (2004).
  120. J. -M. Paik, Y. -J. Park, M. -S. Yoon, and Y.-C. Joo, “Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films,” Scripta Mater. 48(6), pp. 683-688 (2003).
  121. J. -Y. Choi, S. -S. Lee, and Y.-C. Joo, “Electromigration behavior of eutectic SnPb solder”, Jpn. J. Appl. Phys. 41(12), pp. 7487-7490 (2002).
  122. J. -Y. Kwon, K. -S. Kim, Y.-C. Joo, and K. -B. Kim, “The simulation of copper diffusion profile in SiO2 during bias temperature stress(BTS) test”, Jpn. J. Appl. Phys. 41, pp. 91-101 (2002).
  123. A. -S. Choi, Y. -J. Park, and Y.-C. Joo, “Electromigraion-induced via failure assisted by neighboring-clusters”, Scripta Mater. 46, pp. 247-251 (2002).
  124. M. -S. Yoon, Y. -J. Park, and Y.-C. Joo, “Impurity redistributions in electroplated Cu films during self-annealing”, Thin Solid Films 408, pp. 230-235 (2002).
  125. T. Y. Tsui and Y.-C. Joo, “A new technique to measure through film thickness fracture toughness”, Thin Solid Films 401, pp. 203-210 (2001).
  126. J. -K. Jung, Y. -J. Park, N. -M. Hwang, and Y.-C. Joo, “Tertiary gain growth driven by surface energy”, Scripta Mater. 45, pp. 267-272 (2001).
  127. Y. -J. Park and Y.-C. Joo, “Electromigration-induced stress interaction between vias and polygranular clusters”, Scripta Mater. 44(10), pp. 2497-2501 (2001)

Patents

  1. 유기젤 전도제 및 그를 포함하는 전자 장치, #10-1713240 (17/02/28, Korea)
  2. 금속-탄소 나노섬유, #10-1683797-00-00 (16/12/01, Korea)
  3. 금속-탄소 나노섬유의 제조방법, #10-1605155-00-00 (16/03/15, Korea)
  4. 금속-탄소 나노섬유 및 그 제조방법, #PCT/KR2015/007852 (15/07/28, PCT)
  5. 금속-탄소 나노섬유의 제조방법, #10-1605155 (16/03/15, Korea)
  6. 유연소자의 신축성 및 신뢰성 강화를 위한 기판구조, #10-2016-0160729 (16/11/29)
  7. Negative Electrode for Secondary Battery and Manufacturing Method Therefore, #PCT/KR2014/009457 (14/10/08, PCT)
  8. 상변화 메모리소자의 세트시간 및 데이터 유지시간의 예측장법, #10-1650481-00-00 (16/08/17, Korea)
  9. 구리/탄소 나노섬유의 이종금속 형성 기술 및 그 제조 방법, #10-2016-0056260 (16/05/09, Korea)
  10. 금속-탄소 나노섬유, #10-2016-0030415 (16/03/14, Korea)
  11. 유기젤 전도제 및 그를 포함하는 전자 장치, #10-2015-0078238 (15/06/02, Korea)
  12. 마그네슘 합금의 성형성 증가 방법(Method for Increasing Formability of Magnesium Alloy), #10-1071522-00-00 (11/09/30, Korea)
  13. 금속/탄소 나노섬유 및 탄소 나노섬유의 다공성 제어방법, #10-2015-0151010 (15/10/29, Korea)
  14. 칼코젠화합물-탄소 나노섬유 및 그의 제조방법, #10-2015-0109479 (15/08/03, Korea)
  15. 다목적 기계적 변형 시험기, #10-2015-0103726 (15/07/22, Korea)
  16. 저항변화 소자 및 그 제조방법 #10-1531154-00-00 (15/06/18, Korea)
  17. 구리-탄소 나노섬유 및 그 제조방법, #10-1482613-00-00 (15/01/08, Korea)
  18. 멀티 플러그를 이용한 멀티 비트 ＯTＰ 메모리 소자와 그제조 및 동작방법, #10-1446332-00-00 (14/09/24, Korea)
  19. 유연성 소자용 부재 및 그 제조방법, #10-1414096-00-00 (14/06/25, Korea)
  20. 유연 기판 구조체의 열화특성 평가방법 #10-1365996-00-00 (14/02/17, Korea)
  21. Semiconductor Device and Method of Fabricating the same #10-1326711 (13/11/01, Korea)
  22. Device for Evaluating Leakage Current of Dielectric Layer and Method of Fabricating the same #10-1244919 (13/03/11, Korea)
  23. Anode of Lithium Secondary Battery and Manufacturing Method thereof #1187347 (12/09/05, Korea)
  24. Method for Forming Metal/Carbon Nanotube Composite Film and Metal/Carbon Nanotube Composite Film Using the same #1134352 (12/04/02, Korea)
  25. A Moving Rapid Thermal Annealing Apparatus for Manufacturing Printed Film #1107560 (12/01/12, Korea)
  26. Method for Manufacturing Printed Film using Moving Rapid Thermal Annealing and Printed Film Manufactured by using the same #1107559 (12/01/12, Korea)
  27. Method for Forming Metal Wiring and Metal Wiring using the same #1038784 (05/27/11, Korea)
  28. Multi-bit Memory Device using Multi-plug #7929330 (04/19/11, U. S.)
  29. Apparatus and Method For Measuring Electromigration #1003870 (12/17/10, Korea)
  30. Hydrogen Sensor And Method For Manufacturing The Same #0990815 (10/22/10, Korea)
  31. Method For Manufacturing Nanowire #0982055 (09/07/10, Korea)
  32. Memory Cell Using Electromigration Effect #0903418 (06/10/09, Korea)
  33. Apparatus for Testing the Electrical Properties and Confidence of Semiconductor #0864416 (10/14/08, Korea)
  34. Apparatus for testing the electrical properties and confidence of semiconductor and the package #0864406 (10/14/08, Korea)
  35. Hybrid-type Thrust Gas Bearing for a Micro-turbine #0566836 (03/27/06, Korea)
  36. Method of Through-etching Substrate #0471744 (02/03/05, Korea)
  37. Method of Through-etching Substrate #6821901 (11/23/04, U. S.)
  38. Reversible Seal Package for Micro Electro Mechanical Systems #0418241 (01/29/04, Korea)
  39. Barrier Layer Integrity Test #6633083 (10/14/03, U. S.)
  40. Low Temperature Direct Bonding Method of Glass Substrate and Silicon Wafer #0386954 (05/27/03, Korea)
  41. Method for Determining Metal Concentration in a Field Area #6348701 (02/19/02, U. S.)
  42. Adhesion Strength Testing Using a Depth-Sensing Indentation Technique #6339958 (01/22/02, U. S.)
  43. Method for Electrically Measuring Size of Internal Void in Electrically Conductive Lead #6242924 (06/05/01, U. S.)
  44. Method of Forming Copper/Copper Alloy Interconnection with Reduced Electromigration #6242349 (06/05/01, U. S.)
  45. Storage-Annealing Plated Cu Interconnects #6228768 (05/08/01, U. S.)
  46. Method for Forming Conformal Barrier Layers #6124203 (09/26/00, U. S.)
  47. Method of Forming a Void Free Copper Interconnects #6121141 (09/19/00, U. S.)
  48. Method of Measuring Fracture Toughness of Thin Films #6053034 (04/02/00, U. S.)
  49. Simulation code for grain growth in patterned interconnects: registration # 2001-01-12-7640 (11/10/01, Korea) (Registered computer program)
  50. Method of Through-etching Substrate #2002-246856 (Japan)