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Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

Home Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

저자

J. -M. Paik, Y. -J. Park, M. -S. Yoon, and Y.-C. Joo

저널 정보

Scripta Mater. 48(6), pp. 683-688 (2003).

출간연도

2003

링크

https://doi.org/10.1016/S1359-6462(02)00563-8

J. -M. Paik, Y. -J. Park, M. -S. Yoon, and Y.-C. Joo, “Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films,” Scripta Mater. 48(6), pp. 683-688 (2003).