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Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

Home Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

저자

S.-Y. Jung, B.-J. Kim, N.-Y. Lee, B.-M. Kim, S.-J. Yeom, N.-J. Kwak, and Y.-C. Joo

저널 정보

Microelectron. Eng., 89(1), pp. 58-61 (2012).

출간연도

2012

링크

https://doi.org/10.1016/j.mee.2011.01.070

S.-Y. Jung, B.-J. Kim, N.-Y. Lee, B.-M. Kim, S.-J. Yeom, N.-J. Kwak, and Y.-C. Joo, “Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects”, Microelectron. Eng., 89(1), pp. 58-61 (2012).