S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “Characteristics of Leakage Current in the Dielectric Layer due to Cu Migration during Bias Temperature Stress”, J. Appl. Phys. 104(4), pp. 044511 (2008).
저자
S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo
저널 정보
J. Appl. Phys. 104(4), pp. 044511 (2008).
출간연도
2008
S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “Characteristics of Leakage Current in the Dielectric Layer due to Cu Migration during Bias Temperature Stress”, J. Appl. Phys. 104(4), pp. 044511 (2008).