Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*, “Copper Bonding Technology in Heterogeneous Integration”. Electronic Materials Letters, 2023, 20, 1-25, DOI: 10.1007/s13391-023-00433-4.
저자
Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*
저널 정보
Electronic Materials Letters, 2023, 20, 1-25
출간연도
2023
Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*, “Copper Bonding Technology in Heterogeneous Integration”. Electronic Materials Letters, 2023, 20, 1-25, DOI: 10.1007/s13391-023-00433-4.