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서울대학교 서울대학교 미세유연소자재료 연구실

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Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles

Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles

저자

Kyung-Tae Jang, Jae-Sun Hwang, Yong-Jin Park, Jae-Chan Lee, Na-Rae Kim, Ji-Woo Yu, and Young-Chang Joo

저널 정보

RSC Advances, 9719, 2017

출간연도

2017

링크

https://doi.org/10.1039/C6RA27259B

Kyung-Tae Jang, Jae-Sun Hwang, Yong-Jin Park, Jae-Chan Lee, Na-Rae Kim, Ji-Woo Yu, and Young-Chang Joo, “Current-induced morphological evolution and reliability of Ag interconnects fabricated by a printing method based on nanoparticles”, RSC Advances, 9719, 2017 DOI: 10.1039/C6RA27259B

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