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Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects

Home Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects

Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects

저자

S.-M. Yi, C. Shim, H.-C. Lee, J.-W. Han, K.-H. Kim and Y.-C. Joo

저널 정보

Microelectron. Eng. 85(3), pp. 621 (2008)

출간연도

2008

링크

https://doi.org/10.1016/j.mee.2007.11.006

S.-M. Yi, C. Shim, H.-C. Lee, J.-W. Han, K.-H. Kim and Y.-C. Joo, “Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects”, Microelectron. Eng. 85(3), pp. 621 (2008)