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Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines

Home Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines

Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines

저자

J.-M. Paik, K.-C. Park, H. Park, and Y.-C. Joo

저널 정보

J. Appl. Phys. 97, pp. 104513 (2005).

출간연도

2005

링크

https://link.springer.com/article/10.1557/PROC-795-U6.2

J.-M. Paik, K.-C. Park, H. Park, and Y.-C. Joo, “Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines”, J. Appl. Phys. 97, pp. 104513 (2005).