Young-Joo Lee, Han-Wool Yeon, Sung-Yup Jeong, Se-Kwon Na, Jong-Seung Park, Yong-Yoon Choi, Oh-Sung Song, and Young-Chang Joo, “Effect of Film Thickness and Deposition Rate of TiN diffusion Barrier for 3-D Cu Through Silicon Via”, Electronic Materials Letters 10(1), 2013 DOI: 10.1007/s13391-013-3108-0.