J.-M. Paik, I.-M. Park, and Y.-C. Joo, “Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI”, Thin Solid Films 504, pp. 294 (2006).
저자
J.-M. Paik, I.-M. Park, and Y.-C. Joo
저널 정보
Thin Solid Films 504, pp. 294 (2006).
출간연도
2006
J.-M. Paik, I.-M. Park, and Y.-C. Joo, “Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI”, Thin Solid Films 504, pp. 294 (2006).