Home Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions
저자
J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park
저널 정보
J. Elec. Mat., 37(8), pp.1111 (2008)
출간연도
2008
링크
https://doi.org/10.1007/s11664-008-0491-7
J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park, “Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions”, J. Elec. Mat., 37(8), pp.1111 (2008)