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Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

저자

J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park

저널 정보

J. Elec. Mat., 37(8), pp.1111 (2008)

출간연도

2008

J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park, “Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions”, J. Elec. Mat., 37(8), pp.1111 (2008)