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Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects

Home Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects

Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects

저자

J.-M.Paik, H. Park and Y.-C. Joo

저널 정보

Microelectronic Eng. 71, pp.348-357 (2004).

출간연도

2004

링크

https://doi.org/10.1016/j.mee.2004.02.094

J.-M.Paik, H. Park and Y.-C. Joo, “Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects”, Microelectronic Eng. 71, pp.348-357 (2004).