H.-S. Min, O.-S. Song, Y.-C. Joo, “Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding”, J. of Electronic Packaging, 126, pp.120-123 (2004).
저자
H.-S. Min, O.-S. Song, Y.-C. Joo
저널 정보
J. of Electronic Packaging, 126, pp.120-123 (2004).
출간연도
2004
H.-S. Min, O.-S. Song, Y.-C. Joo, “Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding”, J. of Electronic Packaging, 126, pp.120-123 (2004).