S.-M. Yi, J.-U. An, S.-S. Hwang, J.-R. Yim, Y.-H. Huh, Y.-B. Park and Y.-C. Joo, “Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability”, Thin Solid Films 516(8), pp. 2325 (2008)
저자
S.-M. Yi, J.-U. An, S.-S. Hwang, J.-R. Yim, Y.-H. Huh, Y.-B. Park and Y.-C. Joo
저널 정보
Thin Solid Films 516(8), pp. 2325 (2008)
출간연도
2008
S.-M. Yi, J.-U. An, S.-S. Hwang, J.-R. Yim, Y.-H. Huh, Y.-B. Park and Y.-C. Joo, “Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability”, Thin Solid Films 516(8), pp. 2325 (2008)