Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee*, Byoung-Joon Kim*, “Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations”. Journal of Electronic Packaging, 2022, 144(4), 041017, DOI: 10.1115/1.4054183