Kyung-Tae Jang, So-Yeon Lee, Se-Kwon Na, Sol-Kyu Lee, Jong-Min Baek, Woo-Kyung You, Ok-Hee Park, Rak-Hwan Kim, Hyeok-Sang Oh, and Young-Chang Joo, “Electromigration Characteristcs and Morphological Evolution of Cu Interconnects on CVD Co and Ru Liners for 10-nm Class VLSI Technology”, IEEE Electronic Device Letters, 29(7) 2018 DOI: 10.1109/LED.2018.2840507