바로가기 메뉴
본문 바로가기
푸터 바로가기

서울대학교 서울대학교 미세유연소자재료 연구실

사이트맵
TOP

Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects

Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects

저자

Y. -C. Joo, C. V. Thompson

저널 정보

Journal of Applied Physics 81(9), 1997 doi: http://dx.doi.org/10.1063/1.364454

출간연도

1997

링크

http://dx.doi.org/10.1063/1.364454

Y. -C. Joo, C. V. Thompson, “Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects”, Journal of Applied Physics 81(9), 1997 doi: http://dx.doi.org/10.1063/1.364454

목록 보기