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Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures

Home Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures

Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures

저자

S.-J. Hwang, J. Koike, and Y.-C. Joo

저널 정보

Materials Science Forum, (2005).

출간연도

2005

링크

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3641

S.-J. Hwang, J. Koike, and Y.-C. Joo, “Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures”, Materials Science Forum, (2005).