Home Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness
저자
J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park
저널 정보
Jap. J. Appl. Phys. 43, (2004).
출간연도
2004
링크
https://iopscience.iop.org/article/10.1143/JJAP.43.3346
J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park, “Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness”, Jap. J. Appl. Phys. 43, (2004).