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Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness

Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness

저자

J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park

저널 정보

Jap. J. Appl. Phys. 43, (2004).

출간연도

2004

J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park, “Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness”, Jap. J. Appl. Phys. 43, (2004).