Hakjun Kim, Intae Kim, Wonsik Lee, Jae Young Hwang, Sarah Eunkyung Kim, Young-Chang Joo*, Hyejin Jang*, “Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration”, Electronic Materials Letters (2025), DOI: https://doi.org/10.1007/s13391-025-00591-7