M.-H. Jeong, G.-T. Lim, B.-J. Kim, J. Kim, K. Lee, Y.-C. Joo, and Y.-B. Park, “Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps”, J. Elec. Mat., 39(10), pp. 1-7 (2010).
저자
M.-H. Jeong, G.-T. Lim, B.-J. Kim, J. Kim, K. Lee, Y.-C. Joo, and Y.-B. Park
저널 정보
J. Elec. Mat., 39(10), pp. 1-7 (2010).
출간연도
2010
M.-H. Jeong, G.-T. Lim, B.-J. Kim, J. Kim, K. Lee, Y.-C. Joo, and Y.-B. Park, “Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps”, J. Elec. Mat., 39(10), pp. 1-7 (2010).