B.-J. Kim, G.-T. Lim, J. Kim, K. Lee, Y.-B. Park, H.-Y. Lee, and Y.-C. Joo, “Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing”, J. Elec. Mat., Article in Press, pp. 1-5 (2010).
저자
B.-J. Kim, G.-T. Lim, J. Kim, K. Lee, Y.-B. Park, H.-Y. Lee, and Y.-C. Joo
저널 정보
J. Elec. Mat., Article in Press, pp. 1-5 (2010).
출간연도
2010
B.-J. Kim, G.-T. Lim, J. Kim, K. Lee, Y.-B. Park, H.-Y. Lee, and Y.-C. Joo, “Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing”, J. Elec. Mat., Article in Press, pp. 1-5 (2010).