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Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape

Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape

저자

Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*

저널 정보

IEEE Access, 2022, 10, 100675-100681

출간연도

2022

Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*, “Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape”. IEEE Access, 2022, 10, 100675-100681, DOI: 10.1109/ACCESS.2022.3207284