Home Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
저자
Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*
저널 정보
IEEE Access, 2022, 10, 100675-100681
출간연도
2022
링크
https://doi.org/10.1109/ACCESS.2022.3207284
Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*, “Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape”. IEEE Access, 2022, 10, 100675-100681, DOI: 10.1109/ACCESS.2022.3207284