H. Park, S.-J. Hwang, Y.-C. Joo, “Stress-induced Surface Damages and Grain Boundary Characteristics of in Sputtered and Electroplated Copper Thin Films”, Acta Mat. 52, pp 2435-2440 (2004).
저자
H. Park, S.-J. Hwang, Y.-C. Joo
저널 정보
Acta Mat. 52, pp 2435-2440 (2004).
출간연도
2004
H. Park, S.-J. Hwang, Y.-C. Joo, “Stress-induced Surface Damages and Grain Boundary Characteristics of in Sputtered and Electroplated Copper Thin Films”, Acta Mat. 52, pp 2435-2440 (2004).