S.-J. Hwang, Y.-C. Joo, J. Koike, “Stress Relaxation during Isothermal Annealing in Electroplated Cu Films”, Thin Solid Films 516(21), pp. 7588-7594 (2008).
저자
S.-J. Hwang, Y.-C. Joo, J. Koike
저널 정보
Thin Solid Films 516(21), pp. 7588-7594 (2008).
출간연도
2008
S.-J. Hwang, Y.-C. Joo, J. Koike, “Stress Relaxation during Isothermal Annealing in Electroplated Cu Films”, Thin Solid Films 516(21), pp. 7588-7594 (2008).