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Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bais stress

Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bais stress

저자

Sol-Kyu Lee, Kyung-Tae Jang, Seol-Min Yi, Young-Chang Joo

저널 정보

IEEE International Reliability Physics Symposium (IRPS), 4A.5 2018

출간연도

2018

Sol-Kyu Lee, Kyung-Tae Jang, Seol-Min Yi, Young-Chang Joo, “Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bais stress”, IEEE International Reliability Physics Symposium (IRPS), 4A.5 2018 DOI: 10.1109/IRPS.2018.8353578