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서울대학교 서울대학교 미세유연소자재료 연구실

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Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

저자

Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*

저널 정보

IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641

출간연도

2023

링크

http://doi.org/10.1109/TCPMT.2023.3317383

Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*, “Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability”, IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641, DOI: 10.1109/TCPMT.2023.3317383

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