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Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness

Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness

저자

J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo

저널 정보

J. Elec. Mat., 34, pp.559 (2005).

출간연도

2005

J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo, “Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness”, J. Elec. Mat., 34, pp.559 (2005).