Home Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness
저자
J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo
저널 정보
J. Elec. Mat., 34, pp.559 (2005).
출간연도
2005
링크
https://link.springer.com/article/10.1007/s11664-005-0065-x
J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo, “Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness”, J. Elec. Mat., 34, pp.559 (2005).