2025
Sulfur Extraction for Stoichiometry Control of Cobalt Sulfides by Reducing Gas Annealing
In-Kyoung Ahn, Intae Kim, Young-Chang Joo*
Electronic Materials Letters (2025)
2025
Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration
Hakjun Kim, Intae Kim, Wonsik Lee, Jae Young Hwang, Sarah Eunkyung Kim, Young-Chang Joo*, Hyejin Jang*
Electronic Materials Letters (2025)
2025
In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors
Youngran Jung, Wonhyo Joo, Kyung Rul Lee, Cheol Kim, Min-Jung Choi, Young-Chang Joo*, So-Yeon Lee*
Electronic Materials Letters 421, 464–472 (2025)
2025
Optimization of co-sputtered zinc indium tin oxide-based MOSFET-type sensor for effective NO2 gas detection
Hunhee Shin1, Jinwoo Park, Donghee Kim, Kangwook Choi, Min-Kyu Park, Joon Hwang, Seongi Lee, Young-Chang Joo, Gyuweon Jung*, Jong-Ho Lee*
Sensors & Actuators: B. Chemical 428 (2025) 137262
2025
Unveiling the reconstruction of copper bimetallic catalysts during CO2 electroreduction
Intae Kim1, Gi-Baek Lee1, Sungin Kim, Hyun Dong Jung, Ji-Yong Kim, Taemin Lee, Hyesung Choi, Jaeyeon Jo, Geosan Kang, Sang-Ho Oh, Woosuck Kwon, Deokgi Hong, Hyoung Gyun Kim, Yujin Lee, Unggi Kim, Hyeontae Kim, Miyoung Kim, Seoin Back*, Jungwon Park*, Young-Chang Joo* & Dae-Hyun Nam*
Nature Catalysis, 2025, 8, 697-713
2024
Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects
Seongi Lee¹, Jae-Myeong Shin¹, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo, Byoung-Joon Kim*, So-Yeon Lee*
Journal of Materials Research and Technology, 2024, 29, 851-856
2024
Bonding structure and dry etching characteristics in amorphous B-C-N films for hardmask applications
Hongik Kim¹, Unggi Kim¹, Deokgi Hong, Sungtae Kim, Seungwu Han, Young-Chang Joo*, and So-Yeon Lee*
Carbon, 2024, 226, 119218
2024
Understanding the Electrical Characteristics of Electrochemical Metallization Memristors through Identification of Conduction Channel in Entire Active Area
Dokyun Kim¹, Unggi Kim, Sungjae Choi, and Young-Chang Joo*
Electronic Materials Letters, 2024, 20, 525-536
2024
Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films
Jae Young Hwang¹, Dokyun Kim¹, Hyejin Jang*, So-Yeon Lee*, and Young-Chang Joo*
Electronic Materials Letters, 2024, 20, 648-656
2024
Thermodynamic phase control of Cu-Sn alloy electrocatalysts for selective CO2 reduction
Soohyun Go, Woosuck Kwon, Deokgi Hong, Taemin Lee, Sang-Ho Oh, Daewon Bae, Jeong-Heon Kim, Seolha Lim, Young-Chang Joo, Dae-Hyun Nam*
Nanoscale Horizons, (2024)
2024
Fully Biodegradable Electrochromic Display for Disposable Patch
Se-Hun Kang, Ju-Yong Lee, Joo-Hyeon Park, Sung-Geun Choi, Sang-Ho Oh, Young-Chang Joo, Seung-Kyun Kang*
npj Flexible Electronics, 2024, 8, 72
2024
Porous Cu/C nanofibers promote electrochemical CO2-to-ethylene conversion via high CO2 availability
Daewon Bae, Taemin Lee, Woosuck Kwon, Sang-Ho Oh, Dae-Hyun Nam*
Journal of Materials Chemistry A, 2024, 12, 17295-17305
2024
Predictive synthesis of transition metal carbide via thermochemical oxocarbon equilibrium
Sang-Ho Oh, Dohun Kim, Ji-Yong Kim, Geosan Kang, Jooyoung Jeon, Miyoung Kim, Young-Chang Joo* and Dae-Hyun Nam*
Journal of the American Chemical Society, 2024, 146, 26, 17940-17955
2023
Effect of N doping on the microstructure and dry etch properties of amorphous carbon deposited with a DC sputtering system
Sungtae Kim¹, Min-Woo Jeong¹, Kuntae Kim, Ung-gi Kim, Miyoung Kim, So-Yeon Lee * and Young-Chang Joo*
RSC Advances, 2023, 13(3), 2131–2139
2023
Unravelling rate-determining step and consequence of O2- or H2O-assisted, wet CO transformation on catalytic CuO-CeO2 domains via interfacial engineering
Dong Ho Kim¹, Sang-Ho Oh¹, Heon Phil Ha, Young-Chang Joo*, Jongsik Kim*
Applied Surface Science, 2023, 614, 156099
2023
Copper Bonding Technology in Heterogeneous Integration
Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*
Electronic Materials Letters, 2023, 20, 1-25
2023
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*
IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641
2023
Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties
Sungtae Kim, Ung-gi Kim, Jinseok Ryu, Dokyun Kim, Miyoung Kim, Young-Chang Joo* and So-Yeon Lee*
Applied Surface Science, 2023, 637, 157895
2023
Selective hydrocarbon or oxygenate production in CO2 electroreduction over metallurgical alloy catalysts
Ji-Yong Kim¹, Heh Sang Ahn¹, Intae Kim¹, Deokgi Hong, Taemin Lee, Jaeyeon Jo, Hyeontae Kim, Min Kyung Kwak, Hyoung Gyun Kim, Geosan Kang, Soohyun Go, Wook Ha Ryu, Gun-Do Lee, Miyoung Kim, Dae-Hyun Nam*, Eun Soo Park* and Young-Chang Joo* | Nature Synthesis, 2023
2022
Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*
IEEE Access, 2022, 10, 100675-100681