2025

Sulfur Extraction for Stoichiometry Control of Cobalt Sulfides by Reducing Gas Annealing

In-Kyoung Ahn, Intae Kim, Young-Chang Joo*

Electronic Materials Letters (2025)

2025

Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration

Hakjun Kim, Intae Kim, Wonsik Lee, Jae Young Hwang, Sarah Eunkyung Kim, Young-Chang Joo*, Hyejin Jang*

Electronic Materials Letters (2025)

2025

In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors

Youngran Jung, Wonhyo Joo, Kyung Rul Lee, Cheol Kim, Min-Jung Choi, Young-Chang Joo*, So-Yeon Lee*

Electronic Materials Letters 421, 464–472 (2025)

2025

Optimization of co-sputtered zinc indium tin oxide-based MOSFET-type sensor for effective NO2 gas detection

Hunhee Shin1, Jinwoo Park, Donghee Kim, Kangwook Choi, Min-Kyu Park, Joon Hwang, Seongi Lee, Young-Chang Joo, Gyuweon Jung*, Jong-Ho Lee*

Sensors & Actuators: B. Chemical 428 (2025) 137262

2025

Unveiling the reconstruction of copper bimetallic catalysts during CO2 electroreduction

Intae Kim1, Gi-Baek Lee1, Sungin Kim, Hyun Dong Jung, Ji-Yong Kim, Taemin Lee, Hyesung Choi, Jaeyeon Jo, Geosan Kang, Sang-Ho Oh, Woosuck Kwon, Deokgi Hong, Hyoung Gyun Kim, Yujin Lee, Unggi Kim, Hyeontae Kim, Miyoung Kim, Seoin Back*, Jungwon Park*, Young-Chang Joo* & Dae-Hyun Nam*

Nature Catalysis, 2025, 8, 697-713

2024

Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects

Seongi Lee¹, Jae-Myeong Shin¹, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo, Byoung-Joon Kim*, So-Yeon Lee*

Journal of Materials Research and Technology, 2024, 29, 851-856

2024

Bonding structure and dry etching characteristics in amorphous B-C-N films for hardmask applications

Hongik Kim¹, Unggi Kim¹, Deokgi Hong, Sungtae Kim, Seungwu Han, Young-Chang Joo*, and So-Yeon Lee*

Carbon, 2024, 226, 119218

2024

Understanding the Electrical Characteristics of Electrochemical Metallization Memristors through Identification of Conduction Channel in Entire Active Area

Dokyun Kim¹, Unggi Kim, Sungjae Choi, and Young-Chang Joo*

Electronic Materials Letters, 2024, 20, 525-536

2024

Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films

Jae Young Hwang¹, Dokyun Kim¹, Hyejin Jang*, So-Yeon Lee*, and Young-Chang Joo*

Electronic Materials Letters, 2024, 20, 648-656

2024

Thermodynamic phase control of Cu-Sn alloy electrocatalysts for selective CO2 reduction

Soohyun Go, Woosuck Kwon, Deokgi Hong, Taemin Lee, Sang-Ho Oh, Daewon Bae, Jeong-Heon Kim, Seolha Lim, Young-Chang Joo, Dae-Hyun Nam*

Nanoscale Horizons, (2024)

2024

Fully Biodegradable Electrochromic Display for Disposable Patch

Se-Hun Kang, Ju-Yong Lee, Joo-Hyeon Park, Sung-Geun Choi, Sang-Ho Oh, Young-Chang Joo, Seung-Kyun Kang*

npj Flexible Electronics, 2024, 8, 72

2024

Porous Cu/C nanofibers promote electrochemical CO2-to-ethylene conversion via high CO2 availability

Daewon Bae, Taemin Lee, Woosuck Kwon, Sang-Ho Oh, Dae-Hyun Nam*

Journal of Materials Chemistry A, 2024, 12, 17295-17305

2024

Predictive synthesis of transition metal carbide via thermochemical oxocarbon equilibrium

Sang-Ho Oh, Dohun Kim, Ji-Yong Kim, Geosan Kang, Jooyoung Jeon, Miyoung Kim, Young-Chang Joo* and Dae-Hyun Nam*

Journal of the American Chemical Society, 2024, 146, 26, 17940-17955

2023

Effect of N doping on the microstructure and dry etch properties of amorphous carbon deposited with a DC sputtering system

Sungtae Kim¹, Min-Woo Jeong¹, Kuntae Kim, Ung-gi Kim, Miyoung Kim, So-Yeon Lee * and Young-Chang Joo*

RSC Advances, 2023, 13(3), 2131–2139

2023

Unravelling rate-determining step and consequence of O2- or H2O-assisted, wet CO transformation on catalytic CuO-CeO2 domains via interfacial engineering

Dong Ho Kim¹, Sang-Ho Oh¹, Heon Phil Ha, Young-Chang Joo*, Jongsik Kim*

Applied Surface Science, 2023, 614, 156099

2023

Copper Bonding Technology in Heterogeneous Integration

Yoon‑Gu Lee¹, Michael McInerney, Young‑Chang Joo, In‑Suk Choi* and Sarah Eunkyung Kim*

Electronic Materials Letters, 2023, 20, 1-25

2023

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

Hakjun Kim¹, Jae Young Hwang¹, Sarah Eunkyung Kim, Senior Member, IEEE, Young-Chang Joo*, and Hyejin Jang*

IEEE Transactions on Components, Packanging and Manufacturing Technology, 13(10) pp. 1624-1641

2023

Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties

Sungtae Kim, Ung-gi Kim, Jinseok Ryu, Dokyun Kim, Miyoung Kim, Young-Chang Joo* and So-Yeon Lee*

Applied Surface Science, 2023, 637, 157895

2023

Selective hydrocarbon or oxygenate production in CO2 electroreduction over metallurgical alloy catalysts

Ji-Yong Kim¹, Heh Sang Ahn¹, Intae Kim¹, Deokgi Hong, Taemin Lee, Jaeyeon Jo, Hyeontae Kim, Min Kyung Kwak, Hyoung Gyun Kim, Geosan Kang, Soohyun Go, Wook Ha Ryu, Gun-Do Lee, Miyoung Kim, Dae-Hyun Nam*, Eun Soo Park* and Young-Chang Joo* | Nature Synthesis, 2023

2022

Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape

Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee*, Young‑Chang Joo*

IEEE Access, 2022, 10, 100675-100681