• Dae-Hyun Nam, Ho-Young Kang, Jun-Hyun Jo, Byung Kyu Kim, Sekwon Na, Uk Sim, In-Kyoung Ahn, Kyung-Woo Yi, Ki Tae Nam, and Young-Chang Joo, “Controlled Molybdenum Disulfide Assembly inside Carbon Nanofiber by Boudouard Reaction Inspired Selective Carbon Oxidation”, Advanced Materials, 1605327, 2017 DOI: 10.1002/adma.201605327.
  • Yoo-Yong Lee, Ho-Young Kang, Seok Hyeon Gwon, Gwang Mook Choi, Seung-Min Lim, Jeong-Yun Sun, and Young-Chang Joo, “A Strain-Intensive Stretchable Electronic Conductor: PEDOT-PSS/Acrylamide Organogels”, Advanced Materials, 28(1636) 2016 DOI: 10.1002/adma.201504606.
  • Han-Wool Yeon, Seung-Min Lim, Jung-Kyu Jung, Hyobin Yoo, Young-Joo Lee, Ho-Young Kang, Young-Jin Park, Miyoung Kim, and Young-Chang Joo, “Structural-Relaxation-Driven Electron Doping in Amorphous Oxide Semiconductors through the Increase in Concentration of Oxygen Vacancies in the Shallow-Donor State”, NPG Asia Materials, 8(e250), 2016 doi:10.1038/am.2016.11.
  • Yong-Jin Park, Ju-Young Cho, Min-Woo Jeong, Sekwon Na, and Young-Chang Joo, “New Pathway for the Formation of Metallic Cubic Phase Ge-Sb-Te Compounds Induced by an Electric Current”, Scientific Reports, 6(21466), 2016 doi:10.1038/srep21466.
  • Kyung-Tae Jang, Yong-Jin Park, Min-Woo Jeong, Seung-Min Lim, Han-Wool Yeon, Ju-Young Cho, Min-Gi Jin, Jin-Sub Shin, Byoung-Wook Woo, Jang-Yong Bae, Yu-Chul Hwang, and Young-Chang Joo, “Electromigration behavior of advanced metallization on the structural effects for memory devices”, Microelectronic Engineering Corresponding, 156(97), 2016
  • Sekwon Na, Tae-yil Eom, Young-Chang Joo, and Hoo-Jeong Lee, “Effects of the Mo composition of Mo-alloyed Yb/Si contacts: microstructure evolution and electrical properties”, Japanese Journal of Applied Physics, 55(6S3), 2016
  • Yoo-Yong Lee, Gwang Mook Choi, Seung-Min Lim, Ju-Young Cho, In-Suk Choi, Ki Tae Nam and Young-Chang Joo, “Growth Mechanism of Strain-Dependent Morphological Change in PEDOT:PSS Films”, Scientific Reports, 6(25332) 2016 doi:10.1038/srep25332.
  • Byoung-Joon Kim, Hae-A-Seul Shin, Ji-Hoon Lee, and Young-Chang Joo, “Effect of cyclic outer and inner bending on the fatigue behavior of a multi-layer metal film on a polymer substrate”, Japanese Journal of Applied Physics, 55(6S3) 2016
  • Su Hong Kwak, Seung-Ryong Kwon, Seol Baek, Seung-Min Lim, Young-Chang Joo, and Taek Dong Chung, “Densely charged polyelectrolyte-stuffed nanochannel arrays for power generation from salinity gradient”, Scientific Reports, 6(26416) 2016 doi:10.1038/srep26416.
  • Seong Sik Shin, Woon Seok Yang, Eun Joo Yeom, Seon Joo Lee, Nam Joong Jeon, Young-Chang Joo, Ik Jae Park, Jun Hong Noh, and Sang Il Seok, “Tailoring of Electron-Collecting Oxide Nanoparticulate Layer for Flexible Perovskite Solar Cells”, J. Phys. Chem. Lett. 7(10) 2016 DOI: 10.1021/acs.jpclett.6b00295.
  • Jiwoo Yu, Dae-Hyun Nam, Young-Joo Lee, and Young-Chang Joo, “Electrospun Magnetic Nanofiber as Multifunctional Flexible EMI-Shielding Layer and its Optimization on the Effectiveness”, Journal of the Microelectronics and Packaging Society, 23(2) 2016 DOI : 10.6117/kmeps.2016.23.2.057.
  • Han-Wool Yeon, Jun-young Song, Seung-Min Lim, and Young-Chang Joo, “Effect of pulsed electric fields on dielectric breakdown in Cu damascene interconnects”, Applied Physics Express 8, 2015
  • Dae-Hyun Nam, Ji Woo Kim, Ji-Hoon Lee, So-Yeon Lee, Hae-A-Seul Shin, Se-Hee Lee, and Young-Chang Joo, “Tunable Sn Structures in Porosity-Controlled Carbon Nanofibers for All-Solid-State Lithium-Ion Battery Anodes”, Journal of Materials Chemistry A 3, 2015 DOI: 10.1039/C5TA00884K.
  • Ju-Young Cho, Dohyung Kim, Yong-Jin Park, Tae-Youl Yang, Yoo-Yong Lee, and Young-Chang Joo, “The phase-change kinetics of amorphous Ge2Sb2Te5 and device characteristics investigated by thin-film mechanics”, Acta Materialia 94, 2015
  • Ji-Hoon Lee, Ji Woo Kim, Ho-Young Kang, Seul Cham Kim, Sang Sub Han, Kyu Hwan Oh, Se-Hee Lee, and Young-Chang Joo, “The effect of energetically coated ZrOx on enhanced electrochemical performances of Li(Ni1/3Co1/3Mn1/3)O2 cathodes using modified radio frequency (RF) sputtering”, Journal of Materials Chemistry A 24, 2015 DOI: 10.1039/C5TA02055G.
  • Young-Joo Lee, Hae-A-Seul Shin, Dae-Hyun Nam, Han-Wool Yeon, Boae Nam, Kyoohee Woo, and Young-Chang Joo, “Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer”, Electronic Materials Letters 11(1) 2015 DOI: 10.1007/s13391-014-4191-6.
  • Byoung-Joon Kim, Thomas Haas, Andreas Friederich, Ji-Hoon Lee, Dae-Hyun Nam, Joachim R Binder, Werner Bauer, In-Suk Choi, Young-Chang Joo, Patric A Gruber, and Oliver Kraft, “Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices”, Nanotechnology 25(12), 2014
  • Ji-Hoon Lee, Tae-Youl Yang, Ho-Young Kang, Dae-Hyun Nam, Na-Rae Kim, Yoo-Yong Lee, Se-Hee Lee, and Young-Chang Joo, “Designing Thermal and Electrochemical Oxidation Processes for δ-MnO2 Nanofibers for High-performance Electrochemical Capacitors”, Journal of Materials Chemistry A 20, 2014 DOI: 10.1039/C4TA00342J.
  • Juree Hong, Sanggeun Lee, Heetak Han, Chandreswar Mahata, Han-Wool Yeon, Bon-Woong Koo, Seong-Il Kim, Taewook Nam, Byung-Wook Min, Young-Chang Joo, Young-Woon Kim, Hyungjun Kim, and Taeyoon Lee, “Graphene as an atomically thin barrier to Cu diffusion into Si”, Nanoscale 6(13) 2014 DOI: 10.1039/C3NR06771H.
  • Ju-Young Cho, Tae-Youl Yang, Yong-Jin Park, Yoo-Yong Lee, and Young-Chang Joo, “Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis”, ECS Solid-State Letters 3(6) 2014 doi: 10.1149/2.004406ssl.
  • Hae-A-Seul Shin, Jaechul Ryu, Seungmin Cho, Byung Hee Hong, and Young-Chang Joo, “Graphene-induced Unusual Microstructural Evolution in Ag plated Cu Foils”, Nanoscale 6(13), 2014 DOI: 10.1039/C4NR01163E.
  • Byungil Hwang, Hae-A-Seul Shin, Taegeon Kim, Young-Chang Joo, and Seung Min Han, “Highly Reliable, Flexible and Transparent Ag Nanowire Electrode with Mechanically Welded Junctions”, Small 10(16), 2014 DOI: 10.1002/smll.201303906.
  • Min-Suk Jung, Jong-Hyun Seo, Myoung-Woon Moon, Jang Wook Choi, Young-Chang Joo, and In-Suk Choi, “A Bendable Li-Ion Battery with a Nano-Hairy Electrode: Direct Integration Scheme on the Polymer Substrate”, Advanced Energy Materials 5(1), 2014 DOI: 10.1002/aenm.201400611.
  • Byoung-Joon Kim, Hae-A-Seul Shin, Ji-Hoon Lee, Tae-Youl Yang, Thomas Haas, Patric Gruber, In-Suk Choi, Oliver Kraft, and Young-Chang Joo, “Effect of Film Thickness on Stretchability and Fatigue Resistance of Cu Film on Polymer Substrate”, Journal of Materials Research 29(23), 2014 DOI:
  • Byeong Jo Kim, Dong Hoe Kim, Yoo-Yong Lee, Hee-Won Shin, Gill Sang Han, Jung Sug Hong, Khalid Mahmood, Tae Kyu Ahn, Young-Chang Joo, Kug Sun Hong, Nam-Gyu Park, Sangwook Lee, and Hyun Suk Jun, “Highly Efficient and Bending Durable Perovskite Solar Cells: Toward Wearable Power Source”, Energy & Environmental Science 8, 2014 DOI: 10.1039/C4EE02441A.
  • Dae-Hyun Nam, Ji-Hoon Lee, Na-Rae Kim, Yoo-Yong Lee, Han-Wool Yeon, So-Yeon Lee, and Young-Chang Joo, “One-Step Structure Modulation of Electrospun Metal-loaded Carbon Nanofibers: Redox Reaction Controlled Calcination”, Carbon 82, 2014
  • Yongwon Chung, Sanggeun Lee, Chandreswar Mahata, Jungmok Seo, Seung-Min Lim, Min-su Jeong, Hanearl Jung, Young-Chang Joo, Young-Bae Park, Hyungjun Kim, and Taeyoon Lee, “Coupled Self-assembled Monolayer for Enhancement of Cu Diffusion Barrier and Adhesion Properties”, RSC Advances 4, 2014 DOI: 10.1039/C4RA08134J.
  • Seol-Min Yi, and Young-Chang Joo, “The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment”, J. Microelectron. Packag. Soc. 21(4), 2014 DOI : 10.6117/kmeps.2014.21.4.057.
  • Han-Wool Yeon, Jun-Young Song, Seung-Min Lim, Jang-Yong Bae, Yuchul Hwang, and Young-Chang Joo, “Effect of Dynamic Electric Fields on Dielectric Reliability in Cu Damascene Interconnects”, J. Microelectron. Packag. Soc. 21(4), 2014 DOI : 10.6117/kmeps.2014.21.4.111.
  • Yoo-Yong Lee, Ji-Hoon Lee, Ju-Young Cho, Na-Rae Kim, Dae-Hyun Nam, In-Suk Choi, Ki Tae Nam, and Young-Chang Joo, “Stretching-Induced Growth of PEDOT-Rich Cores: A New Mechanism for Strain-Dependent Resistivity Change in PEDOT:PSS Films”, Advanced Functional Materials 23(32), 2013 DOI: 10.1002/adfm.201203670.
  • Byoung-Joon Kim, Hae-A-Seul Shin, Sung-Yup Jung, Yigil Cho, Oliver Kraft, In-Suk Choi, and Young-Chang Joo, “Crack nucleation during mechanical fatigue in thin metal films on flexible substrates”, Acta Materialia 61 (9), 2013
  • Tae-Youl Yang, Ju-Young Cho, Yong-Jin Park, and Young-Chang Joo, “Driving forces for elemental demixing of GeSbTe in phase-change memory:Computaional study to design the reliable device”, Current Applied Physics 13(7), 2013
  • Young-Joo Lee, Han-Wool Yeon, Sung-Yup Jeong, Se-Kwon Na, Jong-Seung Park, Yong-Yoon Choi, Oh-Sung Song, and Young-Chang Joo, “Effect of Film Thickness and Deposition Rate of TiN diffusion Barrier for 3-D Cu Through Silicon Via”, Electronic Materials Letters 10(1), 2013 DOI: 10.1007/s13391-013-3108-0.
  • Na-Rae Kim, Ji-Hoon Lee, Yoo-Yong Lee, Dae-Hyun Nam, Han-Wool Yeon, So-Yeon Lee, Tae-Youl Yang, Young-Joo Lee, Arim Chu, Ki Tae Nam, and Young-Chang Joo, “Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing”, Journal of Materials Chemistry C 1(37), 2013 DOI: 10.1039/C3TC31037J.
  • Yong-Jin Park, Tae-Youl Yang, Ju-Young Cho, So-Yeon Lee, and Young-Chang Joo, “Electrical current-induced gradual failure of crystalline Ge2Sb2Te5 for phase-change memory”, Applied Physics Letters 103(7), 2013 doi:
  • Chul-Kyu Lee, Se Yeob Park, Hong Yoon Jung, Chang-Kyu Lee, Byeong-Geun Son, Hyo Jin Kim, Young-Joo Lee, Young-Chang Joo, and Jae Kyeong Jeong, “High performance Zn-Sn-O thin film transistors with Cu source/drain electrode”, Physica status solidi (RRL) – Rapid Research Letters 7(3), 2013 DOI: 10.1002/pssr.201206486.
  • Young-Joo Lee, Yong Uk Lee, Han-Wool Yeon, Hae-A-Seul Shin, Louise A. Evans, and Young-Chang Joo, “Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics”, Applied Physics Letters 103(24), 2013 doi:
  • Tae-Youl Yang, Ho-Young Kang, Kyoungsuk Jin, Ji-Hoon Lee, Uk Sim, Hui-Yun Jeong, Young-Chang Joo, and Ki Tae Nam, “An Iron Oxide Photoanode with Hierarchical nanostructure for Efficient Water Oxidation”, Journal of Materials Chemistry A 2(7), 2013 DOI: 10.1039/C3TA13830E.
  • Hae-A-Seul Shin, JaeChul Ryu, Sung-Pyo Cho, Eun-Kyu Lee, SeungMin Cho, Changgu Lee, Young-Chang Joo, and Byung Hee Hong, “Highly Uniform Growth of Monolayer Graphene by Chemical Vapor Deposition on Cu-Ag Alloy Catalysts”, Physical Chemistry Chemical Physics 16(7), 2013 DOI: 10.1039/C3CP54748E.
  • Seunghyun Kim, Yong-Jin Park, Young-Chang Joo, and Young-Bae Park, “High Current Density Effect on In-situ Atomic Migration characteristics of a BiTe Thin Film System”, Japanese Journal of Applied Physics 52(10), 2013
  • Byoung-Joon Kim, YiGil Cho, Min-Suk Jung, Hae-A-Seul Shin, Myoung-Woon Moon, Heung Nam Han, Ki Tae Nam, Young-Chang Joo, and In-Suk Choi, “Fatigue-free, Electrically Reliable Copper Electrode with Nanohole Array”, Small 8(14), 2012 DOI: 10.1002/smll.201200674.
  • M.-S. Jung, S.-B. Lee, H.-Y. Lee, C.-S. Ryu, Y.-G. Ko, H.-W. Park and Y.-C. Joo, “Improvement of Electrochemical Migration Resistance by Cu/Sn Inter-Metallic Compound Barrier on Cu in Printed Circuit Board”, IEEE Transactions on Device and Materials Reliability, in press, (2012)
  • S. Sen, T. G. Edwards, J.-Y. Cho, and Y.-C. Joo “Te-Centric View of the Phase Change Mechanism in Ge-Sb-Te Alloys”, Phys. Rev. Lett., 108(19), p. 165506 (2012)
  • J.-R. Yim, S.-Y. Jung, H.-W. Yeon, J.-Y. Kwon, Y.-J. Lee, J.-H. Lee, Y.-C. Joo, “Effects of Metal Electrode on the Electrical Performance of Amorphous In–Ga–Zn–O Thin Film Transistor”, Jap. J. Appl. Phys., 51(1), p. 011401 (2012)
  • D.-K. Kim, S.-J. Hwang, and Y.-C. Joo, “Failure Mechanisms of W/TiN/Ti Metal Lines under High Current Stressing”, Appl. Phys. Express, 5(2), p. 025801 (2012)
  • S.-H. Hwang, B.-J. Kim, H.-Y. Lee, and Y.-C. Joo, “Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits”, J. Elect. Mat., 41(2) pp. 232-240 (2012)
  • A.S. Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, and Y.-C. Joo, “Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits”, Microelectron. Reliab. 52(3), pp. 530-533 (2012)
  • T.-Y. Yang, J.-Y. Cho, Y.-J. Park, Y.-C. Joo, “Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude electrical-pulse”, Acta.Mater., 60(5), pp. 2012-2030 (2012)
  • J.-Y. Cho, T.-Y. Yang, Y.-J. Park and Young-Chang Joo, “Study on the Resistance Drift in Amorphous Ge2Sb2Te5 According to Defect Annihilation and Stress Relaxation”, Electrochem. Solid. St., 15(4), pp. H81-H83 (2012)
  • H.-A.-S. Shin, B.-J. Kim, J.-H. Kim, S.-H. Hwang, A. S. Budiman, H.-Y. Son, K.-Y. Byun, N. Tamura, M. Kunz, D.-I. Kim, Y.-C. Joo, “Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing”, J. Electron. Mater., 41(4), pp.712-719 (2012)
  • H.-W. Yeon, S.-Y. Jung, J.-R. Lim, J.-W. Pyun, H.-W. Kim, D.-H. Baek and Y.-C. Joo, “Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress”, Electrochem. Solid. St., 15(5), pp. H157-H160 (2012)
  • J.-H. Lee, N.-R. Kim, B.-J. Kim, and Y.-C. Joo, “Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with oxygen-pressure-controlled annealing”, Carbon, 50(1), pp. 98-106 (2012).
  • S.-Y. Jung, B.-J. Kim, N.-Y. Lee, B.-M. Kim, S.-J. Yeom, N.-J. Kwak, and Y.-C. Joo, “Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects”, Microelectron. Eng., 89(1), pp. 58-61 (2012).
  • S.-B. Lee, H.-Y. Lee, M.-S. Jung, Y.-B. Park, and Y.-C. Joo, “Effect of the Composition of Sn-Pb Alloys on the Microstructure of Filaments and the Electrochemical Migration Characteristics”, Met. Mater-Int., 17(4), pp. 617-621 (2011).
  • N.-R. Kim, J.-H. Lee, S.-M. Yi, and Y.-C. Joo, “Highly Conductive Ag Nanoparticulate Films Induced by Movable Rapid Thermal Annealing Applicable to Roll-to-Roll Processing”, J. Electroch. Soc., 158(8), pp. K165-K169 (2011).
  • I.-M. Park, J.-Y. Cho, T.-Y. Yang, E.-S. Park, and Y.-C. Joo, “Thermomechanical Analysis on the Phase Stability of Nitrogen-Doped Amorphous Ge2Sb2Te5 Films”, Jap. J. Appl. Phys., 50(6), p. 061201 (2011).
  • S.-B. Lee, H.-Y. Lee, E. Lee, W. Lee, and Y.-C. Joo, “Fabrication of a Hydrogen Sensor using Palladium-coated Silver Dendrites Formed Electrochemically”, Met. Mater-Int., 16(5), pp. 789-792 (2010).
  • S.-M. Yi, J.-H. Lee, N.-R. Kim, S. Oh, S. Jang, D. Kim, J. Joung, and Y.-C. Joo, “Improvement of Electrical and Mechanical Properties of Ag Nanoparticulate Films by Controlling the Oxygen Pressure”, J. Electroch. Soc., 157(12), pp. K254-K259 (2010).
  • H.-Y. Lee, S.-M. Yi, J.-H. Lee, H.-S. Lee, S. Hyun, and Y.-C. Joo, “Effects of Bending Fatigue on the Electrical Resistance in Metallic Films on Flexible Substrates”, Met. Mater-Int., 16(6), pp. 947-951 (2010).
  • M.-H. Jeong, G.-T. Lim, B.-J. Kim, J. Kim, K. Lee, Y.-C. Joo, and Y.-B. Park, “Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps”, J. Elec. Mat., 39(10), pp. 1-7 (2010).
  • T.-Y. Yang, J.-Y. Cho, and Y.-C. Joo, “Inhibition of the electrostatic force-induced atomic migration in Ge2Sb2Te5 by nitrogen doping”, Electrochem. Solid-State Lett., 13 (9), pp. H321-H323 (2010).
  • B.-J. Kim, G.-T. Lim, J. Kim, K. Lee, Y.-B. Park, H.-Y. Lee, and Y.-C. Joo, “Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing”, J. Elec. Mat., Article in Press, pp. 1-5 (2010).
  • Y.-H. Yoon, S.-M. Yi, J.-R. Yim, J.-H. Lee, and Y.-C. Joo, “Microstructure and electrical properties of high power laser thermal annealing on inkjet-printed Ag films”, Microelectron. Eng. 87 (11), pp. 2230-2233 (2010).
  • S.-B. Lee, M.-S. Jung, H.-Y. Lee, T. Kang, and Y.-C. Joo, “Effect of Bias Voltage on the Electrochemical Migration Behaviors of Sn and Pb”, IEEE Trans. Rel. 9 (3) pp. 483 (2009).
  • I.-M. Park, S.-J. Hwang, J.-H. Lee, and Y.-C. Joo, “Effect of effective modulus on hillock formations in al lines on glass”, Met. Mater-Int. 15 (4), pp. 661 (2009).
  • T.-Y. Yang, I.-M. Park, B.-J. Kim, and Y.-C. Joo, “Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field”, Appl. Phys. Lett. 95, pp. 032104 (2009).
  • T.-Y. Yang, I.-M. Park, H.-Y. You, S.-H. Oh, K.-W. Yi, and Y.-C. Joo, “Change of Damage Mechanism by the Frequency of Applied Pulsed DC in the Ge2Sb2Te5 Line”, J. Electroch. Soc. 156, H617 (2009).
  • J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, and Y.-B. Park, “Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions”, J. Elec. Mat. 38, pp.691-699 (2009).
  • A.S. Budiman, P.R. Besser, C.S. Hau-Riege, A. Marathe, Y.-C. Joo, N. Tamura, J.R. Patel, and W.D. Nix, “Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment”, J. Elec. Mat. 38, pp.379-391 (2009).
  • H.-Y. Lee, S.-J. Suh, S.-R. Kim, S.-Y. Park, Y.-C. Joo, “Measurement of Poisson’s Ratio of a Thin Film on a Substrate by Combining X-Ray Diffraction with in situ Substrate Bending”, Elec. Mat. Lett. 5, pp. 51-54 (2009).
  • J.-R. Yim, A.-R. Min, and Y.-C Joo, “Quantitative Analysis of the Size Distributions and Elements of the Precipitates in Fe-3%Si Alloy during Secondary Recrystallization Annealing using HAADF Imaging and XEDS”, Met. Mater-Int. 15(1), pp. 113 (2009)
  • I.-M. Park, T.-Y. Yang, S. W. Jung, Y. K. Kim, H. Horii, Y.-C. Joo, “Investigation of crystallization behaviors of nitrogen-doped Ge2Sb2Te5 films by thermomechanical characteristics”, Appl. Phys. Lett. 94, pp. 061904 (2009).
  • I.-M. Park, J.-K. Jung, S.-O. Ryu, K.-J. Choi, B.-G. Yu, Y.-B. Park, S.-M. Han, Y.-C. Joo, “Thermomechanical Properties and Mechanical Stresses of Ge2Sb2Te5 Films in Phase-Change Random Access Memory”, Thin Solid Films 517(2), pp. 848 (2008).
  • H. Kwon, S.-S. Jang, Y.-H. Park, T.-S. Kim, Y.-D. Kim, H.-J. Nam, Y.-C. Joo, “Investigation of the electrical contact behaviors in Au-to-Au thin-film contacts for RF MEMS switches”, J. Micromech. Microeng. 18(10), pp. 105010 (2008).
  • S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “Characteristics of Leakage Current in the Dielectric Layer due to Cu Migration during Bias Temperature Stress”, J. Appl. Phys. 104(4), pp. 044511 (2008).
  • S.-J. Hwang, Y.-C. Joo, J. Koike, “Stress Relaxation during Isothermal Annealing in Electroplated Cu Films”, Thin Solid Films 516(21), pp. 7588-7594 (2008).
  • H. Kwon, J.-H. Park, H.-C. Lee, D.-J. Choi, Y.-H. Park, H.-J. Nam, Y.-C. Joo, “Investigation of Similar and Dissimilar Metal Contacts for Reliable Radio Frequency Micorelectromechanical Switches”, Jap. J. Appl. Phys. 47(8), pp. 6558 (2008).
  • J.-Y. Jung, S.-B. Lee, H.-Y. Lee, Y.-C. Joo, Y.-B. Park, “Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions”, J. Elec. Mat., 37(8), pp.1111 (2008)
  • J.-Y. Jung, S.-B. Lee, Y.-C. Joo, H.-Y. Lee and Y.-B. Park, “Anodic Dissolution Characteristics and Electrochemical Migration Lifetimes of Sn Solder in NaCl and Na2SO4 solutions”, Microelectron. Eng. 85(7), pp. 1597 (2008)
  • Lucas A. Berla, Y.-C. Joo, William D. Nix, “A Model for Power Law Creep Controlled Hillock Growth”, Mat. Sci. Eng. A 488, pp. 594 (2008)
  • K.-H. Jang , S.-J. Hwang , Y.-C. Joo, “Effect of capping layer on hillock formation in thin Al films”, Met. Mater-Int. 14(2), pp. 147 (2008)
  • S.-M. Yi, K.-Ho Jang, J.-U. An, S.-S. Hwang, and Y.-C. Joo, “The self-formatting barrier characteristics of Cu-Mg/SiO2 and Cu-Ru/SiO2 films for Cu interconnects”, Microelectron. Reliab. 48(5), pp. 744 (2008)
  • I.-M. Park, J.-K. Jung, T.-Y. Yang, Y.-C. Joo, “Effect of Nitrogen Implantation with Low Dose on Thermomechanical Properties and Microstructure of Ge2Sb2Te5 Films”, Jap. J. Appl. Phys. 47(3), pp. 1491 (2008).
  • M.-S. Yoon, M.-K. Ko, B.-N. Kim, and B.-J. Kim, Y.-B. Park, Y.-C. Joo, “Line length dependence of threshold current density and driving force in eutectic SbPb and SnAgCu solder electromigraion”, J. Appl. Phys. 103(7), pp. 073701 (2008).
  • S.-M. Yi, J.-U. An, S.-S. Hwang, J.-R. Yim, Y.-H. Huh, Y.-B. Park and Y.-C. Joo, “Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability”, Thin Solid Films 516(8), pp. 2325 (2008)
  • S.-M. Yi, C. Shim, H.-C. Lee, J.-W. Han, K.-H. Kim and Y.-C. Joo, “Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects”, Microelectron. Eng. 85(3), pp. 621 (2008)
  • J.-K. Jung, S.-H. Choi, I. Kim, H. C. Jung, J. Joung, Y.-C. Joo, “Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air”, Philos. Mag. 88(3), pp. 339 (2008)
  • H.-W Kim, J.-W. Lee, W.-S. Hwang, B.-H. O, S.-G. Lee, S.-G. Park, J. Kim, D. J. Chung, S. P. Chang, Y.-C. Joo, J. Joo, C. W. Chung, W. J. Park, C.-J. Kang, S. Joo, S. O. Park, C.-G. Yoo, S. K. Kim, J. H. Lee, S.-D. Cho, D.-K. Choi, K. Kim and J.-Y. Jang, “Etching characteristics of photoresist and low-k dielectrics by Ar/O-2 ferrite-core inductively coupled plasmas”, Microelectron. Eng. 85(2), pp. 300 (2008)
  • S.-W. Chen, S. Chada, C.-M Chen, A. L. Greer, Y.-C. Joo, H.-M Lee, D. J. Lewis and K. Suganuma, “Phase stability, phase transformation and reactive phase formation in electronic materials VI – Foreword”, J. Elec. Mat. 36(11), pp. 1407 (2007)
  • S.-J. Hwang, W. D. Nix, Y.-C. Joo, “A model for hillock growth in Al thin films controlled by plastic deformation”, Acta Mat. 55, pp. 5297 (2007).
  • H. Kwon, Y. Yee, S.-H. Kim, J.-M. Ha, S.-C. Kim, K.-C. Song, K.-Y. Um, Y.-C. Joo, H.-J. Nam, and J.-U. Bu, “Micro-optical fiber coupler on silicon bench based on microelectromechanical systems technology”, Jap. J. Appl. Phys. 46(8B), pp. 5473 (2007).
  • H.-W. Kim, S.-H Shim, J.-W Lee, C.-M Lee, H.-J. Hwang, S.-Y. Chung, H.-S. Kim, S.-K. Hwang, G.-Y. Yeom, N.-E. Lee, J.-B. Yoo, Y.-C. Joo, H.-J. Kim, E.-J. Yoon, “Synthesis, structural characterization and photoluminescence properties of SiOx nanowires prepared using a palladium catalyst”, J. Korean Phys. Soc. 50(6), pp.1799 (2007)
  • M.-S. Yoon, M.-K. Ko, O.-h. Kim, Y.-B. Park, W.D. Nix, Y.-C. Joo, “In-situ observation of electromigraion in eutectic SnPb solder lines : Atomic migraion and hillock formation”, J. Elec. Mat., 36, pp.562 (2007).
  • S.-S. Hwang, S.-Y. Jung, and Y.-C. Joo, “The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits”, J. Appl. Phys. 101, pp. 074501 (2007).
  • S.-J. Hwang, J.-H. Lee, C.-O. Jeung, and Y.-C. Joo, “Effect of film thickness and anealing temperature on hilloock distributions in pure Al films”, Scripta Mater. 56, pp.17 (2007).
  • K.-S. Kim, Y.-C. Joo, K.-B. Kim, and J.-Y. Kwon, “Extraction of Cu diffusivities in dielectric materials by numerical calculation and capacitance-voltage measurement”, J. Appl. Phys. 100, pp. 063517 (2006).
  • M.-S. Yoon, S.-B. Lee, O.-H. Kim, Y.-B. Park, and Y.-C. Joo, “Relationship between edge drift and atomic migration during electromigration of eutectic SnPb lines”, J. Appl. Phys. 100, pp. 33715 (2006).
  • J.-M. Paik, I.-M. Park, and Y.-C. Joo, “Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI”, Thin Solid Films 504, pp. 294 (2006).
  • S.-J. Hwang, Y.-C. Joo, Y.-D. Lee, Y.-B. Park, J.-H. Lee, and C.-O. Jeong, “In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing”, Scripta Mater. 54, pp.1841 (2006).
  • J.-M. Paik, I.-M. Park, K.-C. Park, and Y.-C. Joo, “Line Width Dependence of Grain Structure and Stress in Damascene Cu Lines for ULSI”, J. Appl. Phys. 99, pp 024509 (2006).
  • S.-H. Kim, H.-J. Sohn, Y.-C. Joo, Y.-W. Kim, T.-H. Yim, H.-Y. Lee, T. Kang, “Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy”, Surf. Coat. Tech. 199, pp.43 (2005).
  • B.-S. Jeon, K.-J. Park, S.-J. Song, Y.-C. Joo, K.-D Min, “Design, Fabrication, and Testing of a MEMS Microturbine”, J. Mech. Sci. Technol. 19, pp. 682 (2005).
  • S.-J. Hwang, J. Koike, and Y.-C. Joo, “Evolution of stress-Induced Surface Damage and Stress Relaxation of Electroplated Cu Films at Elevated Temperatures”, Materials Science Forum, (2005).
  • S.-S. Hwang, H.-C. Lee, H.-W. Ro, D. Y. Yoon and Y.-C. Joo, “Effect of pore interconnection on Cu-diffusion-induced failures in porous spin-on low-k dielectrics”, Appl. Phys. Lett. 87, pp. 111915 (2005).
  • J.-M. Paik, K.-C. Park, H. Park, and Y.-C. Joo, “Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines”, J. Appl. Phys. 97, pp. 104513 (2005).
  • J.-K. Jung, N. -M. Hwang, Y. –J. Park, and Y.-C. Joo, “Three-dimensional Simulation of Microstructure Evolution in Damascene Interconnects Effect of Overburden Thickness”, J. Elec. Mat., 34, pp.559 (2005).
  • J.-K. Jung, N. -M. Hwang, Y.-C. Joo, and Y. –J. Park, “Grain Growth Simulation of Damascene Interconnects: Effect of Overburden thickness”, Jap. J. Appl. Phys. 43, (2004).
  • H. Park, S.-J. Hwang, Y.-C. Joo, “Stress-induced Surface Damages and Grain Boundary Characteristics of in Sputtered and Electroplated Copper Thin Films”, Acta Mat. 52, pp 2435-2440 (2004).
  • H.-S. Min, O.-S. Song, Y.-C. Joo, “Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding”, J. of Electronic Packaging, 126, pp.120-123 (2004).
  • H. Park, N.-M. Hwang, Y.-C. Joo, D.-Y. Kim, C. H. Han, J.-K. Kim, “Microstructural Evidences of Abnormal Grain Growth by Solid-state Wetting in Fe-3%Si Steel”, J. Appl. Phys. (2004).
  • J.-M.Paik, H. Park and Y.-C. Joo, “Effect of Low-k Dielectric on Stress and Stress Induced Damage in Cu Interconnects”, Microelectronic Eng. 71, pp.348-357 (2004).
  • J.-M.Paik, K.-C. Park, and Y.-C. Joo, “Relationship between Grain Structures and Texture of Damascene Cu Lines”, J. Elec. Mat. l33, pp.48-52 (2004).
  • J. -M. Paik, Y. -J. Park, M. -S. Yoon, and Y.-C. Joo, “Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films,” Scripta Mater. 48(6), pp. 683-688 (2003).
  • J. -Y. Choi, S. -S. Lee, and Y.-C. Joo, “Electromigration behavior of eutectic SnPb solder”, Jpn. J. Appl. Phys. 41(12), pp. 7487-7490 (2002).
  • J. -Y. Kwon, K. -S. Kim, Y.-C. Joo, and K. -B. Kim, “The simulation of copper diffusion profile in SiO2 during bias temperature stress(BTS) test”, Jpn. J. Appl. Phys. 41, pp. 91-101 (2002).
  • A. -S. Choi, Y. -J. Park, and Y.-C. Joo, “Electromigraion-induced via failure assisted by neighboring-clusters”, Scripta Mater. 46, pp. 247-251 (2002).
  • M. -S. Yoon, Y. -J. Park, and Y.-C. Joo, “Impurity redistributions in electroplated Cu films during self-annealing”, Thin Solid Films 408, pp. 230-235 (2002).
  • T. Y. Tsui and Y.-C. Joo, “A new technique to measure through film thickness fracture toughness”, Thin Solid Films 401, pp. 203-210 (2001).
  • J. -K. Jung, Y. -J. Park, N. -M. Hwang, and Y.-C. Joo, “Tertiary gain growth driven by surface energy”, Scripta Mater. 45, pp. 267-272 (2001).
  • Y. -J. Park and Y.-C. Joo, “Electromigration-induced stress interaction between vias and polygranular clusters”, Scripta Mater. 44(10), pp. 2497-2501 (2001)
  • Y. -C. Joo, C. V. Thompson, “Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects”, Journal of Applied Physics 81(9), 1997 doi:
  • Young-Chang Joo, Carl V. Thompson, “Analytic model for the grain structures of near-bamboo interconnects”, Journal of Applied Physics 76(11), 1994 doi:
  • N. Herbots, O. Vancauwenberghe, O. C. Hellman, Y. C. Joo, “Atomic collisions, elastic recombination, and thermal diffusion during thin-film growth from low-energy ion beams”, Nuclear Instruments and Methods in Physics Research B59/60, 1991