Patents

International
  1. Multi-bit Memory Device using Multi-plug #7929330 (04/19/2011, U. S.)
  2. Method of Through-etching Substrate #6821901 (11/23/2004, U. S.)
  3. Barrier Layer Integrity Test #6633083 (10/14/2003, U. S.)
  4. Method for Determining Metal Concentration in a Field Area #6348701 (02/19/2002, U. S.)
  5. Adhesion Strength Testing Using a Depth-Sensing Indentation Technique #6339958 (01/22/2002, U. S.)
  6. Method for Electrically Measuring Size of Internal Void in Electrically Conductive Lead #6242924 (06/05/2001, U. S.)
  7. Method of Forming Copper/Copper Alloy Interconnection with Reduced Electromigration #6242349 (06/05/2001, U. S.)
  8. Storage-Annealing Plated Cu Interconnects #6228768 (05/08/2001, U. S.)
  9. Method for Forming Conformal Barrier Layers #6124203 (09/26/2000, U. S.)
  10. Method of Forming a Void Free Copper Interconnects #6121141 (09/19/2000, U. S.)
  11. Method of Measuring Fracture Toughness of Thin Films #6053034 (04/02/2000, U. S.)
  12. Method of Through-etching Substrate #2002-246856 (Japan)
Domestic
  1. 유기젤 전도제 및 그를 포함하는 전자 장치, #10-1713240 (17/02/28, Korea)
  2. 금속-탄소 나노섬유, #10-1683797-00-00 (16/12/01, Korea)
  3. 금속-탄소 나노섬유의 제조방법, #10-1605155-00-00 (16/03/15, Korea)
  4. 금속-탄소 나노섬유 및 그 제조방법, #PCT/KR2015/007852 (15/07/28, PCT)
  5. 금속-탄소 나노섬유의 제조방법, #10-1605155 (16/03/15, Korea)
  6. 유연소자의 신축성 및 신뢰성 강화를 위한 기판구조, #10-2016-0160729 (16/11/29)
  7. Negative Electrode for Secondary Battery and Manufacturing Method Therefore, #PCT/KR2014/009457 (14/10/08, PCT)
  8. 상변화 메모리소자의 세트시간 및 데이터 유지시간의 예측장법, #10-1650481-00-00 (16/08/17, Korea)
  9. 구리/탄소 나노섬유의 이종금속 형성 기술 및 그 제조 방법, #10-2016-0056260 (16/05/09, Korea)
  10. 금속-탄소 나노섬유, #10-2016-0030415 (16/03/14, Korea)
  11. 유기젤 전도제 및 그를 포함하는 전자 장치, #10-2015-0078238 (15/06/02, Korea)
  12. 마그네슘 합금의 성형성 증가 방법(Method for Increasing Formability of Magnesium Alloy), #10-1071522-00-00 (11/09/30, Korea)
  13. 금속/탄소 나노섬유 및 탄소 나노섬유의 다공성 제어방법, #10-2015-0151010 (15/10/29, Korea)
  14. 칼코젠화합물-탄소 나노섬유 및 그의 제조방법, #10-2015-0109479 (15/08/03, Korea)
  15. 다목적 기계적 변형 시험기, #10-2015-0103726 (15/07/22, Korea)
  16. 저항변화 소자 및 그 제조방법 #10-1531154-00-00 (15/06/18, Korea)
  17. 구리-탄소 나노섬유 및 그 제조방법, #10-1482613-00-00 (15/01/08, Korea)
  18. 멀티 플러그를 이용한 멀티 비트 ＯTＰ 메모리 소자와 그제조 및 동작방법, #10-1446332-00-00 (14/09/24, Korea)
  19. 유연성 소자용 부재 및 그 제조방법, #10-1414096-00-00 (14/06/25, Korea)
  20. 유연 기판 구조체의 열화특성 평가방법 #10-1365996-00-00 (14/02/17, Korea)
  21. Semiconductor Device and Method of Fabricating the same #10-1326711 (13/11/01, Korea)
  22. Device for Evaluating Leakage Current of Dielectric Layer and Method of Fabricating the same #10-1244919 (13/03/11, Korea)
  23. Anode of Lithium Secondary Battery and Manufacturing Method thereof #1187347 (12/09/05, Korea)
  24. Method for Forming Metal/Carbon Nanotube Composite Film and Metal/Carbon Nanotube Composite Film Using the same #1134352 (12/04/02, Korea)
  25. A Moving Rapid Thermal Annealing Apparatus for Manufacturing Printed Film #1107560 (12/01/12, Korea)
  26. Method for Manufacturing Printed Film using Moving Rapid Thermal Annealing and Printed Film Manufactured by using the same #1107559 (12/01/12, Korea)
  27. Method for Forming Metal Wiring and Metal Wiring using the same #1038784 (05/27/11, Korea)
  28. Apparatus and Method For Measuring Electromigration #1003870 (12/17/10, Korea)
  29. Hydrogen Sensor And Method For Manufacturing The Same #0990815 (10/22/10, Korea)
  30. Method For Manufacturing Nanowire #0982055 (09/07/10, Korea)
  31. Memory Cell Using Electromigration Effect #0903418 (06/10/09, Korea)
  32. Apparatus for Testing the Electrical Properties and Confidence of Semiconductor #0864416 (10/14/08, Korea)
  33. Apparatus for testing the electrical properties and confidence of semiconductor and the package #0864406 (10/14/08, Korea)
  34. Low Temperature Direct Bonding Method of Glass Substrate and Silicon Wafer #0386954 (05/27/03, Korea)
  35. Hybrid-type Thrust Gas Bearing for a Micro-turbine #0566836 (03/27/06, Korea)
  36. Method of Through-etching Substrate #0471744 (02/03/05, Korea)
  37. Reversible Seal Package for Micro Electro Mechanical Systems #0418241 (01/29/04, Korea)
  38. Simulation code for grain growth in patterned interconnects: registration # 2001-01-12-7640 (11/10/01, Korea) (Registered computer program)