Materials Science in Micro Device

Class Overview:
The use of devices in nano or micron scale has been increased in the field of information, display, energy, etc. This class will cover how the materials properties (such as microstructure, mechanical properties, and reliability) of the micron or nano size devices are different from those of bulk materials.

Contents:
1. Introduction
– Size Effect on the Materials Properties
– Interconnect and packaging technology for integrated circuits
2. Microstructure Evolution of Thin Films and Lines
– Normal and abnormal Grain growth in thin films
– Texture
– Microstructure evolution in patterned structures
3. Mechanical Properties of Thin Films and Micro Devices
– Source of mechanical stress
– Measurement techniques
– Stress related failures in interconnects
4. Reliability of Nano devices
– Failure mechanisms and Lifetime projection
– Reliability statistics
– Failure mechanism of interconnects (electromigraton, dielectric breakdown)

Evaluation:
Problem Sets, Home works 30%
Midterm Exam 30%
Final Exam 40%
Text
Handouts and review papers (Download from ETL (http://etl.snu.ac.kr))

Reference
 Tu, Mayer, Feldman, Electronic Thin Film Science for Electrical Engineers and Materials Scientists, Macmillian Publishing Company, 1992.
 M. Ohring, The Materials Science of Thin Films, Academic Press, 1992.
 J. W. Mayer and S. S. Lau, Electronic Materials Science: For Integrated Circuits in Si and GaAs, Macmillian, 1990.