바로가기 메뉴
본문 바로가기
푸터 바로가기

서울대학교 서울대학교 미세유연소자재료 연구실

사이트맵
TOP

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

저자

H.-A.-S. Shin, B.-J. Kim, J.-H. Kim, S.-H. Hwang, A. S. Budiman, H.-Y. Son, K.-Y. Byun, N. Tamura, M. Kunz, D.-I. Kim, Y.-C. Joo

저널 정보

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing”, J. Electron. Mater., 41(4), pp.712-719 (2012)

출간연도

2012

링크

https://doi.org/10.1007/s11664-012-1943-7

H.-A.-S. Shin, B.-J. Kim, J.-H. Kim, S.-H. Hwang, A. S. Budiman, H.-Y. Son, K.-Y. Byun, N. Tamura, M. Kunz, D.-I. Kim, Y.-C. Joo, “Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing”, J. Electron. Mater., 41(4), pp.712-719 (2012)

목록 보기